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Type: Conference Session [clear filter]
Tuesday, October 16
 

11:00am CDT

APT1: Trends in Advanced Packaging / 3D Interconnects Room 44 FSA1: Solder Paste Development to Overcome Component Challenges Room 49 MFX1: Solder Printing Room 46 SUB1: Electroless Nickel Immerison Gold Processing Considerations Room 48

1:30pm CDT

APT2: Assembly and Reliability of Bottom Termination Components Room 44 FSA2: Solder Paste Rheology, Performance and Aging Room 49 SUB2: Enhanced Copper Plating Technologies Room 48 MFX2: Assembly Challenges Room 46
 
Wednesday, October 17
 

8:00am CDT

MFX3: Void Reduction/BTC Challenges in Assembly Room 46 APT3: Package Warpage Effects on Assembly and Reliability Room 44 FSA3: Considerations for Assuring Reliable Assemblies Room 49 SUB3: PCB Reliability Room 46

10:30am CDT

APT4: Board Level Reliability Room 44 FSA4: Low Melting Point Materials Development Room 49 MFX4: Cleaning & Coating Room 46 SUB4: Surface Finish Panel Discussion - What's new or different? Room 48

1:00pm CDT

APT5: Advances in Technology for Power Packaging Room 44 MFX5: Reflow Technologies Room 46 SUB5: Microvia Learning Lab Room 48
 
Thursday, October 18
 

8:00am CDT

APT6: Reliability of Intermetallics in Various Interconnects Room 44 INS1: Inspection Applications Room 48 MFX6: Manufacturing Operational Challenges Room 46

10:00am CDT

MFX7: Rework Room 46 APT7: Reliaiblity of Low Temperature Solder (LTS) Interconnects Room 44 INS2: Inspection 4.0 Room 48

1:00pm CDT

INS3: Inspection Capabilities Room 48

3:00pm CDT

INS4: Counterfeit Detection Room 48