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Tuesday
, October 16
11:00am CDT
APT1: Trends in Advanced Packaging / 3D Interconnects
Room 44
FSA1: Solder Paste Development to Overcome Component Challenges
Room 49
MFX1: Solder Printing
Room 46
SUB1: Electroless Nickel Immerison Gold Processing Considerations
Room 48
1:30pm CDT
APT2: Assembly and Reliability of Bottom Termination Components
Room 44
FSA2: Solder Paste Rheology, Performance and Aging
Room 49
SUB2: Enhanced Copper Plating Technologies
Room 48
MFX2: Assembly Challenges
Room 46
Wednesday
, October 17
8:00am CDT
MFX3: Void Reduction/BTC Challenges in Assembly
Room 46
APT3: Package Warpage Effects on Assembly and Reliability
Room 44
FSA3: Considerations for Assuring Reliable Assemblies
Room 49
SUB3: PCB Reliability
Room 46
10:30am CDT
APT4: Board Level Reliability
Room 44
FSA4: Low Melting Point Materials Development
Room 49
MFX4: Cleaning & Coating
Room 46
SUB4: Surface Finish Panel Discussion - What's new or different?
Room 48
1:00pm CDT
APT5: Advances in Technology for Power Packaging
Room 44
MFX5: Reflow Technologies
Room 46
SUB5: Microvia Learning Lab
Room 48
Thursday
, October 18
8:00am CDT
APT6: Reliability of Intermetallics in Various Interconnects
Room 44
INS1: Inspection Applications
Room 48
MFX6: Manufacturing Operational Challenges
Room 46
10:00am CDT
MFX7: Rework
Room 46
APT7: Reliaiblity of Low Temperature Solder (LTS) Interconnects
Room 44
INS2: Inspection 4.0
Room 48
1:00pm CDT
INS3: Inspection Capabilities
Room 48
3:00pm CDT
INS4: Counterfeit Detection
Room 48
Timezone
SMTA International
America/Chicago
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SMTA International
Oct 14
-
18, 2018
Sunday
, October 14
Monday
, October 15
Tuesday
, October 16
Wednesday
, October 17
Thursday
, October 18
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Donald E Stevens Convention Center, Rosemont, IL, USA
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Adobe Gilas
DoubleTree Lobby
Exhibit Hall
Exhibit Hall Courtyard
Exhibit Hall Theater
Room 21/22
Room 40
Room 44
Room 46
Room 47/49
Room 48
Room 49
Room 50
Room 51
Room 52
Room 53
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