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Popular
Popular Events
#1
Dual Keynote Presentation and SMTA Annual Meeting
#2
HE2: Reliability of Lead-Free Solder Alloys in Automotive Environment
#3
HE3: New Materials and Methods for Electronic Products in Harsh Environments
#4
TI Keynote Lunch - The Connected Enterprise - Make Smart Manufacturing Work for You
#5
Electronics Exhibition
#6
Beer Tasting & Expo Reception
#7
APT2: Assembly and Reliability of Bottom Termination Components
#8
Electronics Exhibition
#9
HE4: Improving Manufacturing Process To Provide Better Survivability of Electronic Products
#10
MFX2: Assembly Challenges
#11
¡Livin' La Vida SMTA!
#12
MFX3: Void Reduction/BTC Challenges in Assembly
#13
MFX5: Reflow Technologies
#14
HE1: Predicting Component Life for Harsh Environments
#15
TI4: Additive Manufacturing (3D Printing) for Electronic Circuitry
#16
MFX1: Solder Printing
#17
INS2: Inspection 4.0
#18
MFX4: Cleaning & Coating
#19
SUB3: PCB Reliability
#20
PDC 07: Interconnections: PCB and Solder – Not Just Your Normal Failure Modes Any More
#21
TI2: Industry 4.0: Why Do We Need It?
#22
Women's Leadership Program: Presentations
#23
APT3: Package Warpage Effects on Assembly and Reliability
#24
SUB4: Surface Finish Panel Discussion - What's new or different?
#25
MFX6: Manufacturing Operational Challenges
#26
LF2: High Reliability Pb-free Alloys, SAC305 and Beyond
#27
PDC 11: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World
#28
Spotlight 1
#29
INS3: Inspection Capabilities
#30
LF4: Relaibility of Doped Sn Based Lead-Free Alloys
#31
PDC 02: Jump Start – An Introduction to SMT Process Basics and Troubleshooting - FREE TO ALL ATTENDEES!
#32
TI1: Smart Manufacturing for Electronics
#33
Women's Leadership Program: Table Topics Group Discussion
#34
Women’s Leadership Connection Reception
#35
FSA1: Solder Paste Development to Overcome Component Challenges
#36
APT4: Board Level Reliability
#37
INS1: Inspection Applications
#38
LF3: Properties and Behavior of Solders Containing Bismuth
#39
PDC 19: Reliability of Electronics – the Role of Intermetallic Compounds
#40
APT1: Trends in Advanced Packaging / 3D Interconnects
#41
SUB1: Electroless Nickel Immerison Gold Processing Considerations
#42
FSA2: Solder Paste Rheology, Performance and Aging
#43
Spotlight 2
#44
FSA3: Considerations for Assuring Reliable Assemblies
#45
LF1: Low Temp Solder Paste and its Process Development
#46
PDC 04: Reflow, Wave and Rework Soldering Process Optimization in Electronics Manufacturing
#47
PDC 18: Design for Excellence II: Physics of Failure
#48
Spotlight 3
#49
Learning Lab: Stacked Microvia/Weak Interface Microvia Reliability (Post-Assembly) Project Status
#50
SUB5: Microvia Learning Lab
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Exhibition
Harsh Environments
Lead-Free
Professional Development Course
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Spotlight Session
Technical Innovations Symposium
Women's Leadership Program
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Sunday, Oct 14
Monday, Oct 15
Tuesday, Oct 16
Wednesday, Oct 17
Thursday, Oct 18