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SMTA International has ended

Popular Events

 

#1

Dual Keynote Presentation and SMTA Annual Meeting

#2

HE2: Reliability of Lead-Free Solder Alloys in Automotive Environment

#3

HE3: New Materials and Methods for Electronic Products in Harsh Environments

#4

TI Keynote Lunch - The Connected Enterprise - Make Smart Manufacturing Work for You

#5

Electronics Exhibition

#6

Beer Tasting & Expo Reception

#7

APT2: Assembly and Reliability of Bottom Termination Components

#8

Electronics Exhibition

#9

HE4: Improving Manufacturing Process To Provide Better Survivability of Electronic Products

#10

MFX2: Assembly Challenges

#11

¡Livin' La Vida SMTA!

#12

MFX3: Void Reduction/BTC Challenges in Assembly

#13

MFX5: Reflow Technologies

#14

HE1: Predicting Component Life for Harsh Environments

#15

TI4: Additive Manufacturing (3D Printing) for Electronic Circuitry

#16

MFX1: Solder Printing

#17

INS2: Inspection 4.0

#18

MFX4: Cleaning & Coating

#19

SUB3: PCB Reliability

#20

PDC 07: Interconnections: PCB and Solder – Not Just Your Normal Failure Modes Any More

#21

TI2: Industry 4.0: Why Do We Need It?

#22

Women's Leadership Program: Presentations

#23

APT3: Package Warpage Effects on Assembly and Reliability

#24

SUB4: Surface Finish Panel Discussion - What's new or different?

#25

MFX6: Manufacturing Operational Challenges

#26

LF2: High Reliability Pb-free Alloys, SAC305 and Beyond

#27

PDC 11: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

#28

Spotlight 1

#29

INS3: Inspection Capabilities

#30

LF4: Relaibility of Doped Sn Based Lead-Free Alloys

#31

PDC 02: Jump Start – An Introduction to SMT Process Basics and Troubleshooting - FREE TO ALL ATTENDEES!

#32

TI1: Smart Manufacturing for Electronics

#33

Women's Leadership Program: Table Topics Group Discussion

#34

Women’s Leadership Connection Reception

#35

FSA1: Solder Paste Development to Overcome Component Challenges

#36

APT4: Board Level Reliability

#37

INS1: Inspection Applications

#38

LF3: Properties and Behavior of Solders Containing Bismuth

#39

PDC 19: Reliability of Electronics – the Role of Intermetallic Compounds

#40

APT1: Trends in Advanced Packaging / 3D Interconnects

#41

SUB1: Electroless Nickel Immerison Gold Processing Considerations

#42

FSA2: Solder Paste Rheology, Performance and Aging

#43

Spotlight 2

#44

FSA3: Considerations for Assuring Reliable Assemblies

#45

LF1: Low Temp Solder Paste and its Process Development

#46

PDC 04: Reflow, Wave and Rework Soldering Process Optimization in Electronics Manufacturing

#47

PDC 18: Design for Excellence II: Physics of Failure

#48

Spotlight 3

#49

Learning Lab: Stacked Microvia/Weak Interface Microvia Reliability (Post-Assembly) Project Status

#50

SUB5: Microvia Learning Lab