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Technical Innovations Symposium [clear filter]
Monday, October 15

8:30am CDT

TI1: Smart Manufacturing for Electronics
Chair: Trevor Galbraith, Global SMT & Packaging
Co-Chair: *Gregory Vance, Rockwell Automation

>>An Overview of Smart Manufacturing in the IoT Era. Challenges and Solutions
Glen Farris, Universal Instruments

>>How Do I Get Smart With IPC CFX?
Michael Ford, Aegis Software

>>Smart Manufacturing In The Electronics Industry—Realizing The Digital Factory Vision
Oren Manor, Mentor Graphics, a Siemens Business

Monday October 15, 2018 8:30am - 10:00am CDT
Room 46

10:30am CDT

TI2: Industry 4.0: Why Do We Need It?
Chair: *Marie Cole, IBM Corporation
Co-Chair: Roy Starks, Libra Industries

>>iNEMI Industry 4.0 Roadmap
Ranjan Chatterjee, Cimetrix; Dan Gamota, Jabil;

>>ReMAP Industry 4.0
Workshop/Education Initiatives

Irene Sterian, P.E., Celestica Inc.

>>Panel Discussion
Moderator: Trevor Galbraith, Global SMT & Packaging

Dan Gamota, Jabil
Ranjan Chatterjee, Cimetrix
Irene Sterian, P.E., Celestica, Inc.
*Gregory Vance, Rockwell Automation

Monday October 15, 2018 10:30am - 12:00pm CDT
Room 46

12:30pm CDT

TI Keynote Lunch - The Connected Enterprise - Make Smart Manufacturing Work for You
Chair: *Matt Kelly P.Eng, MBA, IBM Corporation

The Connected Enterprise - Make Smart Manufacturing Work for You
Bob Murphy, Rockwell Automation

*Box lunches are provided so you must pre-register to get a lunch. 
**This session is now full, but you can still indicate if you want to be added to a waitlist and you will be contacted if space becomes available.

Monday October 15, 2018 12:30pm - 1:30pm CDT
Room 46

2:00pm CDT

TI3: Blockchain and Predictive Field Reliability
Chair: *Tom Forsythe, KYZEN Corporation

>>Blockchain Technology for the High-Tech Industry
Quentin Samelson, IBM Corporation

>>Synergy Between Smart Manufacturing & The Secure Supply Chain
​​​​Michael Ford, Aegis Software

Monday October 15, 2018 2:00pm - 3:00pm CDT
Room 46

3:30pm CDT

TI4: Additive Manufacturing (3D Printing) for Electronic Circuitry

Chair: Gary Tanel, Libra Industries
Co-Chair: Carol Primdahl, Krypton Solutions

>>Fully Printed 3D Interconnects: Reducing Semiconductor Package Size and Reducing Manufacturing Complexity
Bryan Germann, Optomec, Inc.

>>3D Printing of Multilayer PCBs and Non-Planar Circuitry
Simon Fried, Nano Dimension USA

>>Direct Digital Manufacturing for 3D Electronic Packaging
Ken Church, nScrypt

Monday October 15, 2018 3:30pm - 5:00pm CDT
Room 46