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Spotlight Session [clear filter]
Tuesday, October 16
 

11:00am CDT

Spotlight 1
FREE for all attendees on the expo show floor!

Chair: *William Capen, Honeywell FM&T

Presenting at 11:00 AM
>>Strain Energy Model for Underfill
*Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories

Presenting at 11:30 AM
>>Solder Paste: Fundamental Material Property / SMT Performance Correlation for NWO, HnP, Solder Bridging and Printability
Nilesh Badwe, Intel Corporation

Presenting at 12:00 PM
>>The Role of Nickel in Solder Alloys - Part 1. The Effect of Ni on the Behavior of Sn-0.7Cu in Soldering and Coating Processes
 Kazuhiro Nogita, The University of Queensland; Keith Sweatman, Tetsuro Nishimura, Nihon Superior Co. Ltd.


Tuesday October 16, 2018 11:00am - 12:30pm CDT
Exhibit Hall Theater

1:30pm CDT

Spotlight 2
FREE for all attendees on the expo show floor!

Chair: Dennis Fritz, SAIC at NAVSEA Crane (Retired)

Presenting at 1:30 PM
>>Trusted Electronics: Recognizing and Addressing the Need
Dean May, US Navy; Randy Cherry, Richard Snogren, Mark Kirkman, IPC

Presenting at 2:00 PM
>>Evaluating “Hybrid” Conformal Coating Chemistries and Processes to Expand the Performance Map for Circuit Board Protection
Jim Stockhausen, Electronics & Engineering Materials ELANTAS PDG Inc.

Presenting at 2:30 PM
>>The Relatively of Harsh Environments and How to Improve Reliability        
*Michael Konrad, Aqueous Technologies

Presenting at 3:00 PM
>>Silicone Science Innovates New UV Curing Conformal Coatings
Chelsea Quinn, The Dow Chemical Company




Tuesday October 16, 2018 1:30pm - 3:30pm CDT
Exhibit Hall Theater
 
Wednesday, October 17
 

10:30am CDT

Spotlight 3
FREE for all attendees on the expo show floor!

Chair: Bob Wettermann, BEST Inc

Presenting at 10:30 AM
>>Packaging’s Impact on Reliability        
Keith Donaldson, Chris Brown, Engineered Materials, Inc.

Presenting at 11:00 AM
>>Modeling Temperature Cycle Fatigue Life of Select SAC Solders
*Michael Osterman, Ph.D., CALCE/University of Maryland

Wednesday October 17, 2018 10:30am - 12:00pm CDT
Exhibit Hall Theater

1:30pm CDT

Spotlight 4
FREE for all attendees on the expo show floor!

This panel will bring together both users and suppliers of Pb-free solder materials to discuss how the definition and expectations related to "high reliability performance" are evolving. We will discuss not only alloy reliability, but other facets of reliability related to board material choices and post-manufacturing surface residues. 

Moderator: Brook Sandy-Smith, Indium Corporation

>>Rising Expectations for "High Reliability": A Panel Discussion
Panelists:
*Richard Coyle, Ph.D., Nokia Bell Labs
*Dave Hillman, Rockwell Collins
Terry Munson, Foresite, Inc.
Kris Troxel, HP, Inc.




Wednesday October 17, 2018 1:30pm - 3:00pm CDT
Exhibit Hall Theater