Loading…
SMTA International has ended

Sign up or log in to bookmark your favorites and sync them to your phone or calendar.

Lead-Free [clear filter]
Thursday, October 18
 

8:00am CDT

LF1: Low Temp Solder Paste and its Process Development
Chair:  Jason Fullerton, Alpha Assembly Solutions
Co-Chair: Debbie Carboni, KYZEN Corporation

>>iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes Part IV: Comprehensive Mechanical Shock Tests on POP Components Having Mixed BGA BiSn-SAC Solder Joints
*Raiyo Aspandiar, Ph.D., Jagadeesh Radhakrishnan, Kevin Byrd, Shunfeng Cheng, Scott Mokler, Kok Kwan Tang, Intel Corporation; Haley Fu, iNEMI; *Babak Arfaei,  Binghamton University; Morgana Ribas, Alpha Assembly Solutions; Jimmy Chen, Flex; Qin Chen, Eunow; Richard Coyle, Nokia; Derek Daily, Senju Comtek Corp., Sophia Feng, Celestica Inc.; Mark Krmpotich, Microsoft Corporation; Brook Sandy-Smith,  Anny Zhang, Indium Corporation; Greg Wu, Wistron; Wilson Zhen, Lenovo

>>Low Temperature Soldering Reflow Optimization for Enhanced Mechanical Reliability
*Morgana Ribas, Ph.D., *Morgana Ribas, Ph.D., H. V. Ramakrishna, Laxminarayana Pai, Raghu Raj Rangaraju, Suresh Telu, Bhaskar Vangapandu, Ramesh Kumar, Traian Cucu, Siuli Sarkar, Alpha Assembly Solutions

>>The Impact of the Alloy Composition on Shear Strength of Low Temperature Lead Free Solder Joints
*Traian Cucu, Ph.D., Anna Lifton, Alpha Assembly Solutions

Thursday October 18, 2018 8:00am - 9:30am CDT
Room 49

10:00am CDT

LF2: High Reliability Pb-free Alloys, SAC305 and Beyond
Chair: Adam Klett, Ph.D., Harris Corporation
Co-Chair:  Jose Ma Servin Olivares, Continental Corporation

>>Effect Of Aging on SAC 305 Solder Joints Reliability in Accelerated Fatigue Shear Test
Raed Al Athmneh, A. Garcia, R. Macias, D. Vazquez, R. Ibarra, M. Abtew, Auburn University

>>Reflow Profiling for Next-Generation Solder Alloys
Meagan Sloan, Brook Sandy-Smith, Indium Corporation; MB Allen, KIC

>>Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys       
*Richard Coyle, Joe Smetana, Nokia Bell Labs; Dave Hillman, Rockwell Collins; Charmaine Johnson, Richard Parker, Brook Sandy-Smith, Hongwen Zhang, Jie Geng, Indium Corporation; Michael Osterman, University of Maryland/ CALCE; Babak Arfaei, Ford Motor Company; Andre Delhaise, Celestica, Inc,; Keith Howell, Nihon Superior Company, Ltd.; Jasbir Bath, Bath Consultancy; Stuart Longgood, Delphi; Andre Kleyner, Sagg Computers; Julie Silk, Keysight Technologies; Ranjit Pandher, Eric Lundeen, and Jerome Noiray, Alpha Assembly Solutions

>>Effect of TIM Compresion Load on BGA Reliability
*Lars Bruno, Ericsson AB; Nicholas Graziano, SUNY; Harry Schoeller, Universal Instruments Corporation 

Thursday October 18, 2018 10:00am - 12:00pm CDT
Room 49

1:00pm CDT

LF3: Properties and Behavior of Solders Containing Bismuth
Chair: *Srinivas Chada, Ph.D., Stryker
Co-Chair: Brook Sandy-Smith, Indium Corporation

>>Crack Propagation Mechanism Study on Bismuth Contained Sn base Lead Free Solder Under Thermo-Mechanical Stress
Imbok Lee, Aakash Valliappan, Young-Woo Lee, Tae-Kyu Lee, MK Electron Co., Ltd.

>Restoration of Microstructure and Mechanical Properties of Lead-Free Bismuth Containing Solder Joints After Accelerated Reliability Testing using a Thermal Treatment
*Andre Delhaise, Ph.D., Ivan Tan, Polina Snugovsky, *Jeff Kennedy, Celestica, Inc.; Mikaella Brillantes, Doug D. Perovic, Department of Materials Science & Engineering, University of Toronto; *David Hillman, David Adams, Rockwell-Collins; Stephan Meschter, BAE Systems; Milea Kammer, Honeywell Aerospace; Ivan Straznicky, Curtiss-Wright

>>Low-Temperature Soldering with Ordered Alloys
Mo Biglari, A. Das, L.C.P. Krassenburg, J.H.G. Brom, N.J.A. van Veen, A.A. Kodentsov , Mat-Tech BV

Thursday October 18, 2018 1:00pm - 2:30pm CDT
Room 49

3:00pm CDT

LF4: Relaibility of Doped Sn Based Lead-Free Alloys
Chair: *Raiyo Aspandiar, Ph.D., Intel Corporation
Co-Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc.

>>Effect on Creep Rate of Alloying Additions to Ni -Stabilized Sn-Cu Eutectic Solders
*Keith Sweatman, Tetsuya Akaiwa, Tetsuro Nishimura, Nihon Superior Company, Ltd

>>Long Term Isothermal Aging of Various BGA Packages Using Doped Lead Free Solder Alloys
*Anto Raj,  Sharath Sridhar, Ph.D., Sivasubramanian Thirugnanasambandam, Ph.D.,  Thomas Sanders, Ph.D., John Evans, Ph.D., Wayne Johnson, Ph.D., Sa'd Hamasha, Ph.D., Auburn University

>>The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High Reliability Pb-Free Solder Alloys
*Richard Coyle, Joe Smetana, Nokia Bell Labs; Dave Hillman, Rockwell Collins; Charmaine Johnson, Richard Parker, Brook Sandy-Smith, Hongwen Zhang, Jie Geng, Indium Corporation; Michael Osterman, University of Maryland/ CALCE; Babak Arfaei, Ford Motor Company; Andre Delhaise, Celestica, Inc,; Keith Howell, Nihon Superior Company, Ltd.; Jasbir Bath, Bath Consultancy; Stuart Longgood, Delphi; Andre Kleyner, Sagg Computers; Julie Silk, Keysight Technologies; Ranjit Pandher, Eric Lundeen, and Jerome Noiray, Alpha Assembly Solutions

Thursday October 18, 2018 3:00pm - 4:30pm CDT
Room 49