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Harsh Environments [clear filter]
Monday, October 15

8:30am CDT

HE1: Predicting Component Life for Harsh Environments
Chair: Sa'd Hamasha, Ph.D., Auburn University
Co-Chair: David Reitz, INVENTEC Performance Chemicals USA

>>Second Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
*Prabjit Singh, Ph.D., Haley Fu, Dem Lee, Jeffrey Lee, Karlos Guo, Jane Li, Simon Lee, Geoffrey Tong, Chen Xu, IBM Corporation

>>Process and Materials Interaction Investigation: Test Methods for Electrochemical Consistency in PCB Assembly Processes - Revisited
Brook Sandy-Smith, Erron Pender, Adam Murling, Indium Corporation

>>Testing and Mitigating Resistor Silver Sulfide Corrosion
Pamela Lembke, *Marie Cole, Jacob Porter, Tim Tofil, Jason Wertz, IBM Corporation; Jim Wilcox, Mike Gaynes, Mike Meilunas, Universal Instruments Corporation; Holly Rubin, Nokia 

Monday October 15, 2018 8:30am - 10:00am CDT
Room 48

10:30am CDT

HE2: Reliability of Lead-Free Solder Alloys in Automotive Environment

Chair: *Babak Arfaei, Ph.D., Ford Motor Company
Co-Chair: Keith Howell, Nihon Superior Co.

>>Developing Pb-Free Solders for Harsh Environment Applications
*Mehran Maalekian, Ph.D., AIM Solder

>>Effect of Component Density on Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Harsh Environment
Won Sik Hong, Jinju Yu, Chulmin Oh , Korea Electronics Technology Institute(KETI)

>> Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes on the Component Reliability in Harsh Thermal Cycling
Francy John Akkara, Mohammed Abueed, Sa’d Hamasha, Ph.D., Jeff Suhling, Ph.D., Pradeep Lal, Ph.D., Auburn University 

Monday October 15, 2018 10:30am - 12:00pm CDT
Room 48

1:30pm CDT

HE3: New Materials and Methods for Electronic Products in Harsh Environments
Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc.
Co-Chair: *Raiyo Aspandiar, Ph.D., Intel Corporation

>>How Wet is Wet – Robust Automotive Electronics in Humid Environment
*Lothar Henneken, Daniel Markus, Daniel Koenig , Robert Bosch GmbH

>>ASEP (Application Specific Electronics Package) A Next Generation Electronics Manufacturing Technology
Victor Zaderej, Richard Fitzpatrick,  Molex

>> Fatigue and Shear Properties of High Reliable Solder Joints for Harsh Applications
Su Sinan, Minghong Jian, Francy John Akkara, Mohammed Abueed, Sa’d Hamasha, Ph.D., Jeff Suhling, Ph.D., Pradeep Lal, Ph.D.,  Auburn University

Monday October 15, 2018 1:30pm - 3:00pm CDT
Room 48

3:30pm CDT

HE4: Improving Manufacturing Process To Provide Better Survivability of Electronic Products
Chair: *Iulia Muntele, Ph,.D., Sanmina Corporation
Co-Chair: Sa'd Hamasha, Ph.D., Auburn University

>>Reducing Spatter in Flux Cored Solder Wires for Robotic Soldering Applications
  Geoffrey Post, Arturo Espejo, Olga Spaldon-Stewart, Kyle Loomis, Kester

>>The Effectiveness of 75% IPA/25% DI Extraction Solution on No-Clean Flux Residues
*Mike Bixenman, DBA, KYZEN Corporation; David Lober, Marietta Lemieux, *Mark McMeen, STI Electronics

>>Improved Condensation Testing to Evaluate Protection Performance of Conformal Coatings Under Different Condensation Levels
*Martin Wickham, Ph.D., Ling Zou, National Physical Laboratory

Monday October 15, 2018 3:30pm - 5:00pm CDT
Room 48