Chair: Sa'd Hamasha, Ph.D., Auburn University Co-Chair: David Reitz, INVENTEC Performance Chemicals USA
>>Second Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test *Prabjit Singh, Ph.D., Haley Fu, Dem Lee, Jeffrey Lee, Karlos Guo, Jane Li, Simon Lee, Geoffrey Tong, Chen Xu, IBM Corporation
>>Process and Materials Interaction Investigation: Test Methods for Electrochemical Consistency in PCB Assembly Processes - Revisited Brook Sandy-Smith, Erron Pender, Adam Murling, Indium Corporation
>>Testing and Mitigating Resistor Silver Sulfide Corrosion Pamela Lembke, *Marie Cole, Jacob Porter, Tim Tofil, Jason Wertz, IBM Corporation; Jim Wilcox, Mike Gaynes, Mike Meilunas, Universal Instruments Corporation; Holly Rubin, Nokia
Monday October 15, 2018 8:30am - 10:00am CDT
Room 48
>>Effect of Component Density on Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Harsh Environment Won Sik Hong, Jinju Yu, Chulmin Oh , Korea Electronics Technology Institute(KETI)
>> Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes on the Component Reliability in Harsh Thermal Cycling Francy John Akkara, Mohammed Abueed, Sa’d Hamasha, Ph.D., Jeff Suhling, Ph.D., Pradeep Lal, Ph.D., Auburn University
Monday October 15, 2018 10:30am - 12:00pm CDT
Room 48
Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc. Co-Chair: *Raiyo Aspandiar, Ph.D., Intel Corporation
>>How Wet is Wet – Robust Automotive Electronics in Humid Environment *Lothar Henneken, Daniel Markus, Daniel Koenig , Robert Bosch GmbH
>>ASEP (Application Specific Electronics Package) A Next Generation Electronics Manufacturing Technology Victor Zaderej, Richard Fitzpatrick, Molex
>> Fatigue and Shear Properties of High Reliable Solder Joints for Harsh Applications Su Sinan, Minghong Jian, Francy John Akkara, Mohammed Abueed, Sa’d Hamasha, Ph.D., Jeff Suhling, Ph.D., Pradeep Lal, Ph.D., Auburn University
Monday October 15, 2018 1:30pm - 3:00pm CDT
Room 48
>>Reducing Spatter in Flux Cored Solder Wires for Robotic Soldering Applications Geoffrey Post, Arturo Espejo, Olga Spaldon-Stewart, Kyle Loomis, Kester
>>The Effectiveness of 75% IPA/25% DI Extraction Solution on No-Clean Flux Residues *Mike Bixenman, DBA, KYZEN Corporation; David Lober, Marietta Lemieux, *Mark McMeen, STI Electronics
>>Improved Condensation Testing to Evaluate Protection Performance of Conformal Coatings Under Different Condensation Levels *Martin Wickham, Ph.D., Ling Zou, National Physical Laboratory
Monday October 15, 2018 3:30pm - 5:00pm CDT
Room 48
