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Conference Session [clear filter]
Tuesday, October 16
 

11:00am CDT

SUB1: Electroless Nickel Immerison Gold Processing Considerations
Chair: *Don Banks, Abbott
Co-Chair: Mark Fulcher, Continental Automotive

>>A Novel Electroless Nickel/Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies
Kunal Shah, Ph.D., LiloTree

>>Can a Cyanide Free Immersion Gold Bath be a Viable Option in the Existing Final Finish Production Environments?
Rick Nichols, Sandra Heinemann, Atotech Deutschland GmbH

>>Effects of ENIG Nickel Corrosion on Wetting Balance Test Results and Intermetallic Formation
*George Milad, *Donald Gudeczauskas, Albin Gruenwald, Uyemura International Corporation

Tuesday October 16, 2018 11:00am - 12:30pm CDT
Room 48

1:30pm CDT

SUB2: Enhanced Copper Plating Technologies
Chair: *Lars Boettcher, Fraunhofer IZM
Co-Chair: *Jörg Trodler, Heraeus Electronics

>>High Elongation Electroless Copper
Rogers Bernards, Judy Ding, Boen Li, Richard Retallick,  MacDermid Enthone Electronic Solutions

>>The Benefits of Using Insoluble Anodes in Acid Copper Plating
*George Milad, Uyemura International Corporation

>>Innovative CU Electroplating Process for Any Layer via Fill With Planer via Top and Thin Surface Copper
Saminda Dharmarathna, Ph.D., Todd Clark, William Bowerman, Kesheng Feng, Jim Watkowski, MacDermid Enthone Electronic Solutions

Tuesday October 16, 2018 1:30pm - 3:30pm CDT
Room 48
 
Wednesday, October 17
 

8:00am CDT

SUB3: PCB Reliability
Chair: *Lars Boettcher, Fraunhofer IZM
Co-Chair: *Jörg Trodler, Heraeus Electronics

>>BGA Pad Cratering and Peeling During SMT Reflow
Joe Fuller, Amit Abraham, Aravind Munukutla, Ian Williams, Intel Corporation

>>PCB Reliability – and How to Audit Your Supply Base to Insure It!
Yashesh Sutariya, Saturn Electronics

>>Influence of Bonding Parameters on Reliability of Cu Wire-bonding to Electroless Ni/Pd/Au Plating
*Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu, Kiyoshi Hasegawa, Hitachi Chemical Co., Ltd.

>>Comprehensive Study of Various Short Failures on Printed Circuited Board
Xiao He, Baojun Qiu, Daojun Luo, CEPREI

Wednesday October 17, 2018 8:00am - 10:00am CDT
Room 46

10:30am CDT

SUB4: Surface Finish Panel Discussion - What's new or different?
Chair: *Don Banks, Abbott
Co-Chair: Lenora Clark, MacDermid Enthone

>>How Does Surface Finish Affect Solder Paste Performance?
*Tony Lentz, FCT Assembly, Inc.

>>Surface Finish Panel
Moderator:

Panelists:
*Julie Silk, Keysight Techonologies
*Lothar Henneken, Ph.D.,Robert Bosch GmbH
Rick Nichols, Atotech
*Srinivas Chada, Stryker



Wednesday October 17, 2018 10:30am - 12:00pm CDT
Room 48

1:00pm CDT

SUB5: Microvia Learning Lab
FREE for all attendees!

Chair: Marc Carter, SAIC

Industry surveys show that HDI technology has experienced a healthy growth from 2000 to present day. The actual CAGR from 2016 to 2017 was double digits. Technological advances are relying more and more on microvia designs. More use and testing has revealed that there are reliability concerns surrounding those designs. In this Learning Lab, we will take a look at the currently accepted methods for microvia reliability testing and expose some weaknesses in the accuracy of those tests when compared to real world working environments. The presentations will be designed to increase awareness of this issue and foster discussion.

>>Current Understanding of the Problem and Mitigation Measures in Place
J.Magera, Motorola

>>FMEA Project Definition
J. Baccam/D.Dupriest, Lockheed Martin

>>Microvia Reliability Modeling and Simulation
G. Lengacher/J. Harms, US Navy


Wednesday October 17, 2018 1:00pm - 3:00pm CDT
Room 48