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Conference Session [clear filter]
Tuesday, October 16
 

11:00am CDT

MFX1: Solder Printing
Chair: *Raymond Lawrence, General Microcircuits Inc.
Co-Chair:  Ivan Roman, Continental Corporation

>>Rational Application of Impractical Stencil Aperture Designs to Enable M0201 Heterogeneous Assembly
*Jeff Schake, Mark Whitmore, ASM Assembly Systems

>>Impact of Stencil Quality & Technology on Solder Paste Printing Performance
Jonas Sjoberg, Jeffrey Len Yung Kwuan, Leon Rao, Evan Yip, Wisdom Qu, Indium Corporation, Asia-Pacific

>>Evaluating the Next Generation of Stencil Stepping Technologies
Greg Smith, Blue Ring Stencils; Chrys Shea , Shea Engineering Services

Tuesday October 16, 2018 11:00am - 12:30pm CDT
Room 46

1:30pm CDT

MFX2: Assembly Challenges
Chair: *Iulia Muntele, Ph.D., Sanmina Corporation
Co-Chair: *Robert Boguski, Datest Corp.

>>Cavity Board SMT Assembly Challenges
Brett Grossman, *Dudi Amir, Intel Corporation

>>How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
*Jasbir Bath, Bath Consultancy; *Greg Smith, BlueRing Stencils; *Tony Lentz, FCT Assembly, Inc.

>>Qualitative Model Describing Hot Tear Above VIPPOs and Numerous Other Design Elements
Günter Gera, Yin Jizhe, Udo Welzel, Robert Bosch GmbH

>>Technology for Components with a High Position Accuracy
*Jörg Trodler, Heraeus Electronics

Tuesday October 16, 2018 1:30pm - 4:00pm CDT
Room 46
 
Wednesday, October 17
 

8:00am CDT

MFX3: Void Reduction/BTC Challenges in Assembly
Chair: Neeta Argawal, Benchmark Electronics
Co-Chair: Timothy O'Neill, AIM Solder

>>Practical Verification of Void Reduction Method for BTC Using Exposed Via in Pad
*Iulia Muntele, Ph.D., Sanmina Corporation

>>Characterizing Voiding in BTC Center Pads
*Chrys Shea, Shea Engineering Services; Neil Poole, Ph.D., Henkel Electronic Materials

>>Solder Paste Selection Challenges for Bottom Termination Components (BTC) Attach
*Anna Lifton, Westin Bent, Paul Salerno, Jason Fullerton, Frank Andres, Alpha Assembly Solutions

Wednesday October 17, 2018 8:00am - 9:30am CDT
Room 46

10:30am CDT

MFX4: Cleaning & Coating
Chair: Sal Sparacino, ZESTRON USA
Co-Chair: Jason Fullerton, Alpha Assembly Solutions

>>Sharp Edge Coverage and Coating Thickness in Determining Performance of Liquid Applied Conformal Coatings in Harsh Environments
Phil Kinner, Electrolube

>>SIR Characterization of No-Clean Flux Residues Under the QFN Component Using Different PCB Board Design Options
*Mike Bixenman, DBA, David Lober, KYZEN Corporation; *Mark McMeen, Collin Langley, STI Electronics

>>Assessing the Implications of Fine Mesh Solder Powder on Flux Residue Removal
Kalyan Nukala, M.S.Ch.E., Ravi Parthasarathy, M.S.Ch.E., ZESTRON Americas; Tim O’Neill, AIM; Terry Munson, Foresite


Wednesday October 17, 2018 10:30am - 12:00pm CDT
Room 46

1:00pm CDT

MFX5: Reflow Technologies
Chair: *Ray Whittier, BAE Systems
Co-Chair: *Chrys Shea, Shea Engineering Services

>>Reflow Blower and Vibration Characterizaion, Effect on BGA Bridging
Jason Stafford, Supriya Agrawal, Intel Corporation

>>Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Fred Dimock, BTU International

>>Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – DoE Tests
*Viktoria Rawinski, Joe Clure, ERSA; Denis Jean, Marcel Buck, Kester

Wednesday October 17, 2018 1:00pm - 3:00pm CDT
Room 46
 
Thursday, October 18
 

8:00am CDT

MFX6: Manufacturing Operational Challenges
Chair: *Jason Keeping, P.E., Celestica, Inc.
Co-Chair: Warren Harper, Honeywell Aerospace

>>Accelerating the Solder Paste Evaluation Process
*Chrys Shea, Shea Engineering Services

>>Requirements on a Class „0“ EPA – BASICS, STANDARDS, ESD Equipments and Measurements
Hartmut Berndt, Dipl.-Ing., B.E.STAT ESD Competence Centre

>>Experimental Study on the Capability and Performance of a Jetting Dispensing Unit In Components Fastening
*Martin Anselm, Ph.D., Keyla Y. Bastardo, Rochester Institute of Technology (RIT)

Thursday October 18, 2018 8:00am - 9:30am CDT
Room 46

10:00am CDT

MFX7: Rework

Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc.
Co-Chair: *Iulia Muntele, Ph.D., Sanmina Corporation

>>Rework Practices for µLED’s and Other Highly Miniaturized SMT Components
Neil O'Brien, Finetech

>>Laser Rework Process  For BGA a New Method for PCBA Rework Instead of Hot Air/Infrared Heating
Vikalp Narayan, John Burke, Naveen Kini, Ben choi, Robin Zhu, Herrick Fu , Alex Dai, Western Digital

>>Comparison Study Between Lead Free Solder and Low Temperature Solder for Hand Soldering Rework
Steve Folsom, Maria Mejias-Hernandez, Connie Lavinger,  Intel Corporation

Thursday October 18, 2018 10:00am - 11:30am CDT
Room 46