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Conference Session [clear filter]
Thursday, October 18
 

8:00am CDT

INS1: Inspection Applications
Chair: *Bill Cardoso, Ph.D., Creative Electron
Co-Chair: *Keith Bryant, YXLON International GmbH

>>How X-ray Technology is Improving the Electronics Assembly Process
Griffin Lemaster, Creative Electron

>>Continuing Test Point Management Throughout a PCB Design Flow

Zac Elliott, Mark Laing, Mentor, a Siemens Business

>>Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes
Miloš Lazić, Brook Sandy-Smith, Indium Corporation; *Martin Anselm, Rochester Institute of Technology (RIT) 

Thursday October 18, 2018 8:00am - 9:30am CDT
Room 48

10:00am CDT

INS2: Inspection 4.0

Chair: *Keith Bryant, YXLON International GmbH
Co-Chair: *Diganta Das, Ph.D., CALCE/ University of Maryland

>>Advancement of Solder Paste Inspection (SPI) Tools to Support Industry 4.0 & Package Scaling
Larry Pymento, Abhishek Prasad, Ph.D., Srinivasa R Aravamudhan and Chandru Periasamy, Intel Corporation

>>Combining Automated Advanced Process Control (APC) with Mounter Feedback to Revolutionize the PCBA Process
David Suh, Brent Fischthal, Koh Young America, Inc.

>>Industry 4.0 for Inspection in the Electronics Industry
*Ragnar Vaga, YXLON International GmbH

>>Extending 3D MRS Technology to Address Challenging Inspection and Measurement Applications
John Hoffman, Ph.D., CyberOptics Corporation

Thursday October 18, 2018 10:00am - 12:00pm CDT
Room 48

1:00pm CDT

INS3: Inspection Capabilities

Chair: *Robert Boguski, Datest Corp.
Co-Chair: Todd McFadden, Bose

>>X-ray Inspection: New Capabilities and Methodology for PCBA Analysis
Julien Perraud, Arnaud Grivon, Shaďma Enouz-Vedrenne, Thales

>>Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA) Package Using Laser Ultrasonic Inspection Technique
Vishnu V.B. Reddy, Chidinma C. Imediegwu, Chong Ye, I. Charles Ume, Bryan Rogers, Cherif Guirguis, Kathy Derksen, Parimal Patel, Georgia Institute of Technology; Kola Akinade, Cisco Systems

>>The Hygroscopic Capacity of Integrated Circuit Packages and Printed Circuit Boards
Steven Watson, David Rathbone, Matthew Domanic, Kaitlyn Fox, VTO Labs

Thursday October 18, 2018 1:00pm - 2:30pm CDT
Room 48

3:00pm CDT

INS4: Counterfeit Detection
Chair: *Terry Kocour, Lockheed Martin
Co-Chair:  Mac Butler, Northrop Grumman Corporation

>>Essential Tools to Combat the Ingress of Counterfeit Materials
*Cameron Shearon, Shearon Consulting

>>Counterfeit Detection Using X-Ray Image as a Fingerprint
*Glen Thomas, Ph.D., Creative Electron, Inc.

>>Use of Component Documentation and Supply Chain for Counterfeit Avoidance
*Diganta Das, Ph.D., CALCE/ University of Maryland

Thursday October 18, 2018 3:00pm - 4:30pm CDT
Room 48