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Conference Session [clear filter]
Tuesday, October 16
 

11:00am CDT

FSA1: Solder Paste Development to Overcome Component Challenges
Chair: Ursula Marquezdetino, Plexus Corp.
Co-Chair: Adam Murling, Indium Corporation

>>Robust SMT No-Clean Solder Paste for SiP and 01005 Assembly
*Ning-Cheng Lee, Ph.D., Xiaoqin Lu, Fen Chen, Indium Corporation

>>The Influence of Aspects of Solder Paste Formulation and Soldering Process Factors on Voiding Under Large QFN Devices
Mathew Jones, Henkel; Tamara Goas-Fernandez; Barry Wenham

>>Rheology and Wetting Characterizations of Flux and Solder Paste for BGA Packages
Jinlin Wang, Intel Corporation

Tuesday October 16, 2018 11:00am - 12:30pm CDT
Room 49

1:30pm CDT

FSA2: Solder Paste Rheology, Performance and Aging
Chair: Md Hasnine, Kester
Co-Chair: Dora Tuza, I Source Technical Services, Inc.

>>How Worst-Case Shipping Scenarios Affect Solder Paste Performance: Part 2
Brook Sandy-Smith, Erron Pender, Indium Corporation

>>Rheology of Flux and Solder Paste II: Shelf Life Study
Fan Gao, Ph.D., Dinesh Amin, Jennifer Allen, Kyle Loomis, Kester

>>Solder Powder Characteristics and Their Impact on Rheological Behavior of Solder Pastes
Arslane Bouchemit, M.Sc.,  Amir Nobari, Ph.D., Ana Da Silva Marques, Sylvain St-Laurent, Gilles L’Espérance, 5N Plus Inc - Micro Powders 

Tuesday October 16, 2018 1:30pm - 3:30pm CDT
Room 49
 
Wednesday, October 17
 

8:00am CDT

FSA3: Considerations for Assuring Reliable Assemblies
Chair: *Phil Kinner, Electrolube
Co-Chair: Nilesh Badwe, Intel Corporation

>>Dissolution Rate of Specific Elements in SAC305 Solder
*David Hillman, Ross Wilicoxon, Tim Pearson, Paul McKenna, Rockwell Collins

>>Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
*Mike Bixenman, DBA, KYZEN Corporation; *Mark McMeen, STI Electronics; *Denis Jean, Kester Solder; Joe Clure, Kurtz Ersa

>>Development of an Enhanced Low Melting Point Alloy
Steven Teliszewski, Interflux Electronics N.V. ; Albrecht Beck, ERSA North America

Wednesday October 17, 2018 8:00am - 10:00am CDT
Room 49

10:30am CDT

FSA4: Low Melting Point Materials Development
Chair: Andy Behr, US Panasonic
Co-Chair: Olga Spaldon-Stewart, Kester

>>Novel High Reliability Low Temperature Solder Alloys
*Ning-Cheng, Lee, Ph.D., Francis Mutuku, Jie Geng, Hongwen Zhang , Indium Corporation

>>A Study on the Minimum and Maximum Temperatures of the Reflow Process in SMT Assembly on Paste Ccontaining Bismuth Alloys Combined With Lead-Free Solder Spheres
*Martin Anselm, Ph.D., Priscilla Gomez, Tayler Swanson, Rochester Institute of Technology (RIT)

>>Engineered Flux for Low Temperature Solders
Ramakrishna Hosur Venkatagiriyappa, Ph.D., Harish H S, Manjuvani J, Vangapandu Bhaskar, Ramesh Kumar, Siuli Sarkar and Vikas Patil, Alpha Assembly Solutions

Wednesday October 17, 2018 10:30am - 12:00pm CDT
Room 49