Loading…
SMTA International has ended

Sign up or log in to bookmark your favorites and sync them to your phone or calendar.

Conference Session [clear filter]
Tuesday, October 16
 

11:00am CDT

APT1: Trends in Advanced Packaging / 3D Interconnects
Chair: *Andrew Mawer, NXP Semiconductors
Co-Chair: Sue Teng, Cisco

>>Evaluation of High Speed Plating for Copper Post with Flat Top Shape and Improved Post Height Uniformity
Yuki Itakura, Shinji Tachibana; Hisamitsu Yamamoto; Shigeo Hashimoto, C. Uyemura & Co., Ltd.

>>Metallization of Glass Interposers
*Charles Woychik, Ph.D., John Lauffer, David Bajkowski, Michael Gaige, Robert Edwards, Gordon Benninger, William Wilson, i3 Electronics

>>Development of High Density Interconnect Technologies for Panel Level Packaging
*Lars Boettcher, Ph.D., Fraunhofer IZM


Tuesday October 16, 2018 11:00am - 12:30pm CDT
Room 44

1:30pm CDT

APT2: Assembly and Reliability of Bottom Termination Components
Chair: *Pradeep Lall, Auburn University
Co-Chair: Satyajit Walwadkar, Ph.D., Intel Corporation

>>The Influence of Printed Circuit Board Thickness on the Thermal Fatigue Reliability of Quad Flat No-Lead Packages
*Richard Coyle,Ph.D., Nokia Bell Labs; David Ihms, Jagadeesh Radhakrishnan; *Neil Hubble, Akrometrix; Jesse deWitt; Charmaine Johnson; Jeffrey Lee; iST-Integrated Service Technology Inc.; Greg Wu; Grace O’Malley, iNEMI

>>As-Shipped Height vs. Mounted Height for LGA and BGA Packages
*Robert Darveaux, Ph.D.,Robert Skyworks; Howard Chen; Shaul Branchevsky; Mahendra Harsha

>>Reliability of TSOP/QFN/Passive Assemblies Under Harsh and LN2 Thermal Cycles
*Reza Ghaffarian, Ph.D., JPL

Tuesday October 16, 2018 1:30pm - 3:30pm CDT
Room 44
 
Wednesday, October 17
 

8:00am CDT

APT3: Package Warpage Effects on Assembly and Reliability
Chair: Robert Darveaux, Skyworks Solutions, Inc
Co-Chair: Steve Murray, Northrup Gumman

>>Effect of Package Warpage and Expansion Characteristics on Failure Modes in Board-Level Thermal Cycling
*Andrew Mawer, NXP Semiconductors

>>Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly Usage
*Pradeep Lall, Ph.D., Auburn University

>>Thermal Shadow Moiré to Cross-Section Correlation Study
Jorge Arellano, Steven Perng, Cisco Systems; Edgardo Alvarez, Jabil Mexico;  Neil Hubble, Akrometrix

Wednesday October 17, 2018 8:00am - 10:00am CDT
Room 44

10:30am CDT

APT4: Board Level Reliability
Chair: Brian Roggeman, Qualcomm Technologies Inc.
Co-Chair: Thomas Zanatta, Zebra Technologies

>>Solder-Joint Reliability of a 0.65mm Molded Array Package for Automotive Applications
*Burton Carpenter, Mollie Benson; *Andrew Mawer, NXP Semiconductors

>>Characterization of SiP Assembly and Reliability Under Thermal Cycles
Jim Wilcox, Universal Instruments Corporation

>>Effective Approach to Enhance The Shock Performance of Ultra-large BGA Components
 Cherif Guirguis, Weidong Xie, Ph.D., Mudasir Ahmad, Gnyaneshwar Ramakrishna, Jianghai Gu, Cisco Systems

Wednesday October 17, 2018 10:30am - 12:00pm CDT
Room 44

1:00pm CDT

APT5: Advances in Technology for Power Packaging
Chair: *Marie Cole, IBM Corporation
Co-Chair: *Jim Wilcox, Universal Instruments Corporation

>>New Soldering Technology for High Temperature Applications: Hot Powder Connection (HotPowCon)
Steffen Käss, *Jörg Trodler, S. Fritzsche, D.Feil, T.Herberholz, Heraeus Deutschland GmbH & Co.KG

>>Liquid Dispensed Thermal Interface Materials for Electronics Applications  
John Timmerman, Ph.D., Henkel

>>Investigation of Copper Sinter Material for Die Attach
*Christian Schwarzer, Heraeus Deutschland GmbH

Wednesday October 17, 2018 1:00pm - 3:00pm CDT
Room 44
 
Thursday, October 18
 

8:00am CDT

APT6: Reliability of Intermetallics in Various Interconnects
Chair: *Burton Carpenter, NXP Semiconductors
Co-Chair: *Don Banks, Abbott

>>Comparison of Reliability of Copper, Gold, Silver, and PCC Wirebonds Under Sustained Operation at 200C
*Pradeep Lall, Ph.D., Shantanu Deshpande, Luu Nguyen, Auburn University

>>Copper-Tin Intermetallics: Their Importance, Growth Rate, and Nature
*Ron Lasky, Ph.D., Indium Corporation


>>The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates
Kazuhiro Nogita, The University of Queensland; Keith Sweatman; Tetsuro Nishimura, Nihon Superior Co. Ltd.

Thursday October 18, 2018 8:00am - 9:30am CDT
Room 44

10:00am CDT

APT7: Reliaiblity of Low Temperature Solder (LTS) Interconnects
Chair: *Charles Woychik, i3Electronics
Co-Chair: *Steve Greathouse, Plexus Corp.

>>Low Temperature Solder Interconnect Reliability and Potential Application in Enterprise Computer and Automotive Electronics

*Paul Wang, Ph.D., David He, Vivi Cao, Jopy Tan, Mitac International Corporation

>>Low Melting Temperature Interconnect Thermal Cycling Performance Enhancement Using Elemental Tuning and Edgebond Application
*Tae Kyu Lee, Ph.D., Andy Hsiao, Mohamed Sheikh, Imbok Lee, Young-Woo Lee, Edward Ibe, Karl Loh, Tae-Kyu Lee, Portland State University

>>A Novel Approach To Determine Mechanical Fatigue Performance of Solder Material Using Single Solder Joint Test
Satyajit Walwadkar, Ph.D., *Raiyo Aspandiar, Ph.D., George Hsieh, Kevin Byrd, Intel Corporation

>>Thermomechanical Reliability of Low-Temperature Solder Alloys for Mid-Power LED Packages
*Ranjit Pandher, Ph.D., Niveditha Nagarajan; Nicholas Herrick, Alpha Assembly Solutions

Thursday October 18, 2018 10:00am - 12:00pm CDT
Room 44