SMTA International: Grid

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Room 40	Room 50	Room 51	Room 52	Room 53

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PDC 04: Reflow, Wave and Rework Soldering Process Optimization in Electronics Manufacturing 8:30am - 12:00pm

PDC 08: Printing and Its Affect on Manufacturing Yield 1:30pm - 5:00pm

PDC 01: Design and Assembly Process Principles for High Density Flexible and Rigid Flex Circuits 8:30am - 12:00pm

PDC 02: Jump Start – An Introduction to SMT Process Basics and Troubleshooting - FREE TO ALL ATTENDEES! 8:30am - 12:00pm

PDC 10: Solder Paste Qualification Using the SMTA Miniaturization Test Vehicle 1:30pm - 5:00pm

PDC 03: The Incredible Shrinking World Of Electronics – Are Traditional DFM, DFR, DFF Methods Obsolete? 8:30am - 12:00pm

PDC 07: Interconnections: PCB and Solder – Not Just Your Normal Failure Modes Any More 1:30pm - 5:00pm

PDC 05: Tin Whiskers: A 2018 State of the Industry Assessment 8:30am - 12:00pm

PDC 09: New Developments in Selective Soldering Technology 1:30pm - 5:00pm

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Room 40	Room 46	Room 47/49	Room 48	Room 50	Room 51	Room 52	Room 53

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PDC 13: Solder Joint Reliability – Principles and Applications 8:30am - 12:00pm

PDC 19: Reliability of Electronics – the Role of Intermetallic Compounds 1:30pm - 5:00pm

TI1: Smart Manufacturing for Electronics 8:30am - 10:00am

TI2: Industry 4.0: Why Do We Need It? 10:30am - 12:00pm

TI Keynote Lunch - The Connected Enterprise - Make Smart Manufac... 12:30pm - 1:30pm

TI3: Blockchain and Predictive Field Reliability 2:00pm - 3:00pm

TI4: Additive Manufacturing (3D Printing) for Electronic Circuitry 3:30pm - 5:00pm

Women's Leadership Program: Presentations 1:30pm - 3:00pm

Women's Leadership Program: Table Topics Group Discussion 3:30pm - 5:00pm

Women’s Leadership Connection Reception 5:00pm - 6:00pm

HE1: Predicting Component Life for Harsh Environments 8:30am - 10:00am

HE2: Reliability of Lead-Free Solder Alloys in Automotive Environment 10:30am - 12:00pm

HE3: New Materials and Methods for Electronic Products in Harsh Environments 1:30pm - 3:00pm

HE4: Improving Manufacturing Process To Provide Better Survivability of Electronic Products 3:30pm - 5:00pm

PDC 11: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World 8:30am - 12:00pm

PDC 17: Ball Grid Array: Design and Assembly of BGAs with Emphasis on Backward Compatibility. 1:30pm - 5:00pm

PDC 14: Weeding Out PCB Fabrication Defects Before Assembly: 8:30am - 12:00pm

PDC 18: Design for Excellence II: Physics of Failure 1:30pm - 5:00pm

PDC 15: Defect Analysis and Process Troubleshooting: Part 1 8:30am - 12:00pm

PDC 16: 10 Defect Analysis and Process Troubleshooting: Part 2 1:30pm - 5:00pm

PDC 12: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration 8:30am - 12:00pm

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Adobe Gilas	Exhibit Hall	Exhibit Hall Theater	Room 21/22	Room 44	Room 46	Room 48	Room 49

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¡Livin' La Vida SMTA! 6:00pm - 9:00pm

Electronics Exhibition 10:00am - 5:00pm

Spotlight 1 11:00am - 12:30pm

Spotlight 2 1:30pm - 3:30pm

Dual Keynote Presentation and SMTA Annual Meeting 8:00am - 10:00am

APT1: Trends in Advanced Packaging / 3D Interconnects 11:00am - 12:30pm

APT2: Assembly and Reliability of Bottom Termination Components 1:30pm - 3:30pm

MFX1: Solder Printing 11:00am - 12:30pm

MFX2: Assembly Challenges 1:30pm - 4:00pm

SUB1: Electroless Nickel Immerison Gold Processing Considerations 11:00am - 12:30pm

SUB2: Enhanced Copper Plating Technologies 1:30pm - 3:30pm

FSA1: Solder Paste Development to Overcome Component Challenges 11:00am - 12:30pm

FSA2: Solder Paste Rheology, Performance and Aging 1:30pm - 3:30pm

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DoubleTree Lobby	Exhibit Hall	Exhibit Hall Courtyard	Exhibit Hall Theater	Room 44	Room 46	Room 48	Room 49

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Fun Run 7:00am - 8:00am

Electronics Exhibition 9:00am - 4:00pm

Beer Tasting & Expo Reception 3:00pm - 4:00pm

Spotlight 3 10:30am - 12:00pm

Spotlight 4 1:30pm - 3:00pm

APT3: Package Warpage Effects on Assembly and Reliability 8:00am - 10:00am

APT4: Board Level Reliability 10:30am - 12:00pm

APT5: Advances in Technology for Power Packaging 1:00pm - 3:00pm

MFX3: Void Reduction/BTC Challenges in Assembly 8:00am - 9:30am

SUB3: PCB Reliability 8:00am - 10:00am

MFX4: Cleaning & Coating 10:30am - 12:00pm

MFX5: Reflow Technologies 1:00pm - 3:00pm

SUB4: Surface Finish Panel Discussion - What's new or different? 10:30am - 12:00pm

Learning Lab: Stacked Microvia/Weak Interface Microvia Reliability (Post-Assembly) Project Statu... 1:00pm - 2:30pm

SUB5: Microvia Learning Lab 1:00pm - 3:00pm

FSA3: Considerations for Assuring Reliable Assemblies 8:00am - 10:00am

FSA4: Low Melting Point Materials Development 10:30am - 12:00pm

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Room 44	Room 46	Room 48	Room 49

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APT6: Reliability of Intermetallics in Various Interconnects 8:00am - 9:30am

APT7: Reliaiblity of Low Temperature Solder (LTS) Interconnects 10:00am - 12:00pm

MFX6: Manufacturing Operational Challenges 8:00am - 9:30am

MFX7: Rework 10:00am - 11:30am

INS1: Inspection Applications 8:00am - 9:30am

INS2: Inspection 4.0 10:00am - 12:00pm

INS3: Inspection Capabilities 1:00pm - 2:30pm

INS4: Counterfeit Detection 3:00pm - 4:30pm

LF1: Low Temp Solder Paste and its Process Development 8:00am - 9:30am

LF2: High Reliability Pb-free Alloys, SAC305 and Beyond 10:00am - 12:00pm

LF3: Properties and Behavior of Solders Containing Bismuth 1:00pm - 2:30pm

LF4: Relaibility of Doped Sn Based Lead-Free Alloys 3:00pm - 4:30pm