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Sunday, October 14 • 1:30pm - 5:00pm
PDC 09: New Developments in Selective Soldering Technology

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PDC9: New Developments in Selective Soldering Technology

Bob Klenke, ITM Consulting
Sunday, October 14 | 1:30pm — 5:00pm

Course Objectives
Selective soldering technology is playing an increasingly critical role in the assembly and reliability of solder interconnections within mixed-technology printed circuit board assemblies. This course reviews new developments in selective soldering technology and outlines their impact upon the electronic assembly landscape. This workshop is based on real-world consulting experience with selective soldering processes procedures and techniques. Best practices together with potential solutions for improving manufacturing yields and reliability will be discussed in detail.

Topics Covered
1. Automatic fiducial location and skew correction • Automatic board warpage compensation
2. Advanced drop-jet flux deposition
3. In-process flux verification
4. Mitigation of no-clean flux residues
5. Dual solder nozzle functionality and benefits
6. Integrated wave soldering capability and advantages
7. Ultra-fine pitch selective soldering
8. Graphics-based programming advanced parameters
9. Advances in solder nozzle design
10. Traceability and data logging compatibility with FIS and Industry 4.0 protocols
11. AOI solder joint inspection methodologies
12. Automatic solder nozzle cleaning and solder nozzle tinning methods
13. High-volume, high-performance soldering
14. Simultaneous parallel and independent double processing modes
15. Variable center distance soldering of multi-up panels
16. On-the-fly continuous motion selective soldering

Sunday October 14, 2018 1:30pm - 5:00pm CDT
Room 53