Course Objectives Design densities for electronic assemblies have increased the interconnection density of PCB’s and component solder connections. This increase density has resulted in smaller via diameters for traditional and micro via hole, complex via structures, terminations of via holes into component mounting pads, decreased component mounting pads and increased diversity of routing terminations to component lead pads. This complexity in interconnection and density of interconnections combined with decreasing component lead pitches and lagging development of industry standards to address these changes has created opportunities for new PCB and solder joint formation failure modes.
As technology continues to march forward, new interconnection failure modes will continue to develop. This presentation will review many of the new PCB interconnection/PCB to solder joint/solder joint failure modes and methods for identification of potential failures/reliability and some recommended potential design/assembly process solutions.
Topics Covered *TBD
Sunday October 14, 2018 1:30pm - 5:00pm CDT
Room 52
