Course Objectives The soldering processes for reflow, wave and rework soldering are essential processes to optimize to improve yield and reliability. The course will review reflow, wave and rework soldering materials and processes with a focus on optimization of preheat and soldering temperatures and times. It will cover typical soldering issues which can occur during reflow, wave and rework with a review of profiles which can be used to help address them with a review of board and component temperature ratings. It will discuss interactions with different board and components having different surface finishes in relation to microstructure and reliability for these processes and factors which should be optimized for improved results.
Topics Covered 1. Reflow, Wave and Rework Soldering materials and processes 2. Common Reflow, Wave and Rework Problems 3. Component and Board Temperature Ratings and Component and Board Surface Finishes 4. Microstructure and Reliability 5. Case studies to optimize soldering processes
Sunday October 14, 2018 8:30am - 12:00pm CDT
Room 40
