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Sunday, October 14 • 8:30am - 12:00pm
PDC 03: The Incredible Shrinking World Of Electronics – Are Traditional DFM, DFR, DFF Methods Obsolete?

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PDC3: The Incredible Shrinking World Of Electronics – Are Traditional DFM, DFR, DFF Methods Obsolete?

*Dale Lee, Plexus Corp.
Sunday, October 15 | 8:30am — 12:00pm

Course Objectives
Today’s electronic component packaging technologies of smaller packages (0201/01005/008003), finer lead pitch (0.4/0.35/0.3/…), bottom terminated components (QFN/LGA) and printed circuit board designs (high layer counts, finer lines, via in pad (VIP), increased copper thicknesses, copper routing, …), increased thermal sensitivity, trailing component, fabrication and assembly industry standards have impacted traditional assembly processes with addition of tight solder application, component placement, thermal management and soldering constraints. Using traditional, simplified mass production techniques are not be sufficient to achieve a high-yielding manufacturing process. This presentation will highlight elements of the impacts of these technologies on reliability and yield when not properly addressed in the design/assembly/inspection-test process, impacts of thermal connections on through-hole and surface soldering processes, introduce the elements of design for matched process (DFMP), and provide examples of several opportunities within the DFMP for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching. The concept of manufacturing, test, reliability by design (XBD) will be presented.

Topics Covered
1. Component packaging impacts
2. PCB design impacts and industry standards limitations
3. SMT and PTH solder design impacts
4. Components with thermal management impacts:
Component design
PCB Thermal balance: X, Y and Z axis
Trace routing
Equipment limitation/tolerance
PCB array tolerance
5. Process tooling design
6. Process control impacts
7. Paste volume, thermal shock SMT and PTH, reflow process warpage
8. Cleaning impacts
9. Compatibility issues, low stand-off components

Sunday October 14, 2018 8:30am - 12:00pm CDT
Room 52