SMTA International

**FREE to all attendees!

PDC2: Jump Start – An Introduction to SMT Process Basics and Troubleshooting

Expert Instructors:
•   *Chrys Shea, Shea Engineering Services
•   Tom Foley, ASM Assembly Systems, LLC
•   Fred Dimock, BTU International

In-Person Moderator: Keith Favre, FHP Reps
On-line Moderator: Mike Buetow, Circuits Assembly Magazine

Sunday, October 14| 8:30am — 12:00pm

This free course is open for all to attend. Its objective is to deliver a basic understanding of SMT fundamentals to technical professionals new to the industry, and will be presented by the following subject matter experts.

Can't make it live? Sign up here to attend via webinar:
https://attendee.gotowebinar.com/register/5397047776691614466 

What You Will Learn:
•    Process Basics
•    Troubleshooting Methods
•    SMT Survival Skills

For Three Core SMT Processes:
•    Stencil Printing
•    Placement
•    Reflow

Who Should Attend:
Engineers, technicians, quality personnel who want to:
•    Learn more about SMT assembly
•    Get more uptime on their assembly lines
•    Improve yields on their assembly lines
•    Reinforce the basics before attending more advanced programs at the conference

Topics Covered
SOLDER PASTE PRINTING – Chrys Shea, Shea Engineering Services
1.    Solder Paste Behavior
   1.1.    Properties & characteristics
   1.2.    Behaviors during the printing process
   1.3.    Printability differences between no-clean and water wash, tin-lead and lead-free
2.    Mechanics of the Printing Process
   2.1.    Alignment and gasketing
   2.2.    PCB support
   2.3.    Squeegee or direct print head motion
   2.4.    Paste setup & release
   2.5.    Area ratios and transfer efficiencies
3.    Troubleshooting Process Problems
   3.1.    5-minute system check
   3.2.    Typical defects and likely root causes to investigate

COMPONENT PLACEMENT – Tom Foley, ASM Assembly Systems
4.    Placement Machine Fundamentals
   4.1.    Component Supply
   4.2.    Placement Head & Vision System
   4.3.    Nozzles & Grippers
5.    Placement Machine Software Fundamentals
   5.1.    Placement Program Optimization
   5.2.    Line Changeover Software
   5.3.    Line Productivity Software
6.    Drivers for High Quality Placement

SOLDER REFLOW – Fred Dimock, BTU
7.    Purpose of Solder Reflow
   7.1.    Oven recipe
   7.2.    Profiles
   7.3.    Process Windows
8.    Material Properties
   8.1.    Solder
      8.1.1.    Eutectic
      8.1.2.    Non -eutectic
   8.2.    Flux with a Purpose
9.    Profile shapes
   9.1.    Heating Rate
   9.2.    Soak
   9.3.    Spike
   9.4.    Cooling Rate
10.    Obtaining Profiles

OPEN QUESTION AND ANSWER PERIOD
In-Person Moderator: Keith Favre, FHP Reps
On-line Moderator: Mike Buetow, Circuits Assembly Magazine