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Monday, October 15 • 1:30pm - 5:00pm
PDC 18: Design for Excellence II: Physics of Failure

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PDC18: Design for Excellence II: Physics of Failure

*Dock Brown, CRE, DfR Solutions
Monday, September 18 | 1:30pm — 5:00pm

Course Objectives
Physics of Failure (PoF) also known as Reliability Physics, is a science-based approach for achieving Reliability by Design in electronic products. The methodology is based on research into the conditions that cause electronic components and materials to fail. A PoF analysis combines dynamic stress analysis of usage and environmental conditions with failure mechanism models to perform a durability simulation that identifies failure susceptibilities and calculated lifetime reliability behavior.

Topics Covered
General Concepts and Models Fitness for Use Five Pillars of DfX Requirements and Parameter Management Use Conditions Structured Design Process Control Process Capability Conceptual Product Space Model Product Life Expectations Materials and Processes Systems Technology Flow Model Rules vs Tools Material Degradation The Bathtub Curve Conformance Failures Random Failures Wear-out Failures Industry Standards PCB Board Material Selection Case Studies Physics of Failure in Boards Board Materials Board Mounting Internal Board Failure Solder Joint Failures Physics of Failure in Components Semiconductors Ceramic Capacitors Film Capacitors Electrolytic Capacitors Connectors

Monday October 15, 2018 1:30pm - 5:00pm CDT
Room 51