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Monday, October 15 • 1:30pm - 5:00pm
PDC 17: Ball Grid Array: Design and Assembly of BGAs with Emphasis on Backward Compatibility.

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PDC17: Ball Grid Array: Design and Assembly of BGAs with Emphasis on Backward Compatibility.

*Ray Prasad, Ray Prasad Consultancy Group
Monday, October 15 | 1:30pm — 5:00pm

Course Objectives
Ball Grid Array (BGA) is one of many surface mount components but it brings unique challenges in both design and assembly of the mixed assembly products. There is great interest in BGA because it offers so many benefits such as real estate savings, high yield and better electrical performance. Despite these promises, there are many problems in BGA and CSP (Chip Scale Packaging). The need to implement lead free simply compounds the problem due to intentional or unintentional mix of tin lead and lead free components on a mixed assembly board.

This course is based on the latest revision (Jan 2013) of IPC-7095C “Design and Assembly Process Implementation for BGA, Rev C” currently chaired by Ray and his book Surface Mount Technology Principles and Practice.

This is not a theoretical course. It is based on Ray’s years of experience in successfully implementing SMT at Boeing and Intel, and various clients including legal cases related backward compatibility. You will get insight into what to do about backward and forward compatibility issues when you have no choice but to deal with tin-lead and lead free BGA on the same board and want to produce products that improve yield, reduce cost and keep away from legal troubles.

In this course we will also talk about major defects such as pad cratering, head in pillow, as ball drop, smiling and frowning BGA and black pad and champing voids. And you will learn everything you wanted to know about voids but were afraid to ask. We will talk about various types of voids in BGA, their impact and their minimization and acceptance criteria to meet industry standard.

You will also get an insight into the interdependency of design and manufacturing to achieve higher yield, lower cost and faster time to market.

Topics Covered
1. BGA Component Styles: Tin-lead, No Lead and High Lead
2. Industry Standard for BGA Design and Assembly (IPC-7095)
3. Driving Forces for BGA
4. Major Concerns with BGA: Moisture and Warpage
5. BGA Design Rules and Guidelines – Impact of ball size, pitch and I/O count
6. BGA Assembly Processes: Issues and Answers
Printing and Reflow Profiling Guidelines
7. Backward & Forward Compatibility Issues and role of selective laser reflow
8. Impact of Lead Free on BGA Reliability
9. Various Types of Voids in BGA, their impact, measurement and control
10. Major Types of BGA Defects
Pad cratering, head in pillow, as ball drop, smiling and frowning BGA and black pad and champing voids
11. (BGA Repair
12. Summary

Monday October 15, 2018 1:30pm - 5:00pm CDT
Room 50