Course Objectives We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear definition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design
Topics Covered Specific Processes General: wrong process, material, etc. Printing Placement Soldering Singulation Coating Mechanical Assembly Testing Specific Defect Examples and Causes Wrong Part Damaged Parts Shorts Opens Poor Wetting Insufficient Contamination New Specific Defects HiP / NWO Graping Pad Cratering CAF Conclusion Questions
Monday October 15, 2018 1:30pm - 5:00pm CDT
Room 52
