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Monday, October 15 • 8:30am - 12:00pm
PDC 14: Weeding Out PCB Fabrication Defects Before Assembly:

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PDC14: Weeding Out PCB Fabrication Defects Before Assembly:

Bihari Patel, Bihari Patel SMT Connection
Monday, October 15 | 8:30am — 12:00pm

Course Objectives
With the Lead Free transition and green revolution changes completed at Assemblers and Fabricators to meet demands of higher densities for Printed Circuit Boards presenter will share his experiences. Global sourcing of PCBs is a reality with larger batch quantities, to prevent line stoppage and expensive rework, it is important that emphasis be placed on PCBs prior to assembly to highlight issues and prevent future issues prior to use. Ensuring quality PCBs are entering in the assembly process, resulting in higher first pass yield and reduced rework associated with PCB quality deficiency. This workshop will highlight any deficiency in PCB fabrication and ones following best practices will be exhibit their strengths against other fabricators. Will also cover key result areas in Assembly Process and Metal Core - LED PCBs their assembly challenges.

Topics Covered
1. Lead Free and Leaded assembly of circuit boards showing defects experienced related to PCB fabrication.
2. 101 of PCB Fabrication for Contract Electronic Manufacturing and Original Equipment Manufacturer
3. Process Control and applicable specifications for outgoing quality.
4. Descriptions with examples of applicable test methods, including reference to IPC documentation
5. Top twenty defects will be highlighted and with emphasis on how to detect, report and get corrective actions for prevention.
6. Fabricator selection, source Inspection and ongoing preferred fabricator audits
7. Case Studies
8. Metal Core - LED PCBs and assembly challenges

Monday October 15, 2018 8:30am - 12:00pm CDT
Room 51