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Sunday, October 14 • 8:30am - 12:00pm
PDC 01: Design and Assembly Process Principles for High Density Flexible and Rigid Flex Circuits

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PDC1: Design and Assembly Process Principles for High Density Flexible and Rigid Flex Circuits

Vern Solberg, Solberg Technical Consulting
Sunday, October 14 | 8:30am — 12:00pm

Course Objectives
This tutorial focuses on implementing best design practices for flexible and rigid flex circuits, the study of alternative fabrication methodologies and planning for automated assembly process efficiency. Information presented will include the selection criteria for base materials for flexible circuit applications, alternative fabrication methodologies, SMT component selection and land pattern development, the requirements for documentation and features required to accommodate SMT-on-flex assembly processing.

Course objectives- Furnish design professionals, systems engineers, assembly and test engineering specialists with a thorough understanding of the materials, fabrication process variations and preferred design practices for flexible and rigid-flex circuits. In addition, extensive detail is furnished regarding preparation for automated SMT assembly including guidance in panel planning to best accommodate current assembly process methodologies.

Topics Covered
1. Applications, standards and defining product use environments
2. Flex circuit construction alternatives
3. Flex and Rigid Flex circuit fabrication process variations
4. SMT component selection and land pattern development
5. Specifying base material, plating and coating 6. Assembly process implementation

Sunday October 14, 2018 8:30am - 12:00pm CDT
Room 50