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Monday, October 15 • 3:30pm - 5:00pm
TI4: Additive Manufacturing (3D Printing) for Electronic Circuitry

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Chair: Gary Tanel, Libra Industries
Co-Chair: Carol Primdahl, Krypton Solutions

>>Fully Printed 3D Interconnects: Reducing Semiconductor Package Size and Reducing Manufacturing Complexity
Bryan Germann, Optomec, Inc.

>>3D Printing of Multilayer PCBs and Non-Planar Circuitry
Simon Fried, Nano Dimension USA

>>Direct Digital Manufacturing for 3D Electronic Packaging
Ken Church, nScrypt

Monday October 15, 2018 3:30pm - 5:00pm CDT
Room 46