This panel will bring together both users and suppliers of Pb-free solder materials to discuss how the definition and expectations related to "high reliability performance" are evolving. We will discuss not only alloy reliability, but other facets of reliability related to board material choices and post-manufacturing surface residues.
Moderator: Brook Sandy-Smith, Indium Corporation
>>Rising Expectations for "High Reliability": A Panel Discussion Panelists: *Richard Coyle, Ph.D., Nokia Bell Labs *Dave Hillman, Rockwell Collins Terry Munson, Foresite, Inc. Kris Troxel, HP, Inc.
