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Tuesday, October 16 • 11:00am - 12:30pm
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FREE for all attendees on the expo show floor!

Chair: *William Capen, Honeywell FM&T

Presenting at 11:00 AM
>>Strain Energy Model for Underfill
*Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories

Presenting at 11:30 AM
>>Solder Paste: Fundamental Material Property / SMT Performance Correlation for NWO, HnP, Solder Bridging and Printability
Nilesh Badwe, Intel Corporation

Presenting at 12:00 PM
>>The Role of Nickel in Solder Alloys - Part 1. The Effect of Ni on the Behavior of Sn-0.7Cu in Soldering and Coating Processes
 Kazuhiro Nogita, The University of Queensland; Keith Sweatman, Tetsuro Nishimura, Nihon Superior Co. Ltd.


Tuesday October 16, 2018 11:00am - 12:30pm CDT
Exhibit Hall Theater