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Thursday, October 18 • 3:00pm - 4:30pm
LF4: Relaibility of Doped Sn Based Lead-Free Alloys

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Chair: *Raiyo Aspandiar, Ph.D., Intel Corporation
Co-Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc.

>>Effect on Creep Rate of Alloying Additions to Ni -Stabilized Sn-Cu Eutectic Solders
*Keith Sweatman, Tetsuya Akaiwa, Tetsuro Nishimura, Nihon Superior Company, Ltd

>>Long Term Isothermal Aging of Various BGA Packages Using Doped Lead Free Solder Alloys
*Anto Raj,  Sharath Sridhar, Ph.D., Sivasubramanian Thirugnanasambandam, Ph.D.,  Thomas Sanders, Ph.D., John Evans, Ph.D., Wayne Johnson, Ph.D., Sa'd Hamasha, Ph.D., Auburn University

>>The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High Reliability Pb-Free Solder Alloys
*Richard Coyle, Joe Smetana, Nokia Bell Labs; Dave Hillman, Rockwell Collins; Charmaine Johnson, Richard Parker, Brook Sandy-Smith, Hongwen Zhang, Jie Geng, Indium Corporation; Michael Osterman, University of Maryland/ CALCE; Babak Arfaei, Ford Motor Company; Andre Delhaise, Celestica, Inc,; Keith Howell, Nihon Superior Company, Ltd.; Jasbir Bath, Bath Consultancy; Stuart Longgood, Delphi; Andre Kleyner, Sagg Computers; Julie Silk, Keysight Technologies; Ranjit Pandher, Eric Lundeen, and Jerome Noiray, Alpha Assembly Solutions

Thursday October 18, 2018 3:00pm - 4:30pm CDT
Room 49