>>Crack Propagation Mechanism Study on Bismuth Contained Sn base Lead Free Solder Under Thermo-Mechanical Stress Imbok Lee, Aakash Valliappan, Young-Woo Lee, Tae-Kyu Lee, MK Electron Co., Ltd.
>Restoration of Microstructure and Mechanical Properties of Lead-Free Bismuth Containing Solder Joints After Accelerated Reliability Testing using a Thermal Treatment *Andre Delhaise, Ph.D., Ivan Tan, Polina Snugovsky, *Jeff Kennedy, Celestica, Inc.; Mikaella Brillantes, Doug D. Perovic, Department of Materials Science & Engineering, University of Toronto; *David Hillman, David Adams, Rockwell-Collins; Stephan Meschter, BAE Systems; Milea Kammer, Honeywell Aerospace; Ivan Straznicky, Curtiss-Wright
>>Low-Temperature Soldering with Ordered Alloys Mo Biglari, A. Das, L.C.P. Krassenburg, J.H.G. Brom, N.J.A. van Veen, A.A. Kodentsov , Mat-Tech BV
Thursday October 18, 2018 1:00pm - 2:30pm CDT
Room 49