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Thursday, October 18 • 1:00pm - 2:30pm
LF3: Properties and Behavior of Solders Containing Bismuth

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Chair: *Srinivas Chada, Ph.D., Stryker
Co-Chair: Brook Sandy-Smith, Indium Corporation

>>Crack Propagation Mechanism Study on Bismuth Contained Sn base Lead Free Solder Under Thermo-Mechanical Stress
Imbok Lee, Aakash Valliappan, Young-Woo Lee, Tae-Kyu Lee, MK Electron Co., Ltd.

>Restoration of Microstructure and Mechanical Properties of Lead-Free Bismuth Containing Solder Joints After Accelerated Reliability Testing using a Thermal Treatment
*Andre Delhaise, Ph.D., Ivan Tan, Polina Snugovsky, *Jeff Kennedy, Celestica, Inc.; Mikaella Brillantes, Doug D. Perovic, Department of Materials Science & Engineering, University of Toronto; *David Hillman, David Adams, Rockwell-Collins; Stephan Meschter, BAE Systems; Milea Kammer, Honeywell Aerospace; Ivan Straznicky, Curtiss-Wright

>>Low-Temperature Soldering with Ordered Alloys
Mo Biglari, A. Das, L.C.P. Krassenburg, J.H.G. Brom, N.J.A. van Veen, A.A. Kodentsov , Mat-Tech BV

Thursday October 18, 2018 1:00pm - 2:30pm CDT
Room 49