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Thursday, October 18 • 10:00am - 12:00pm
LF2: High Reliability Pb-free Alloys, SAC305 and Beyond

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Chair: Adam Klett, Ph.D., Harris Corporation
Co-Chair:  Jose Ma Servin Olivares, Continental Corporation

>>Effect Of Aging on SAC 305 Solder Joints Reliability in Accelerated Fatigue Shear Test
Raed Al Athmneh, A. Garcia, R. Macias, D. Vazquez, R. Ibarra, M. Abtew, Auburn University

>>Reflow Profiling for Next-Generation Solder Alloys
Meagan Sloan, Brook Sandy-Smith, Indium Corporation; MB Allen, KIC

>>Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys       
*Richard Coyle, Joe Smetana, Nokia Bell Labs; Dave Hillman, Rockwell Collins; Charmaine Johnson, Richard Parker, Brook Sandy-Smith, Hongwen Zhang, Jie Geng, Indium Corporation; Michael Osterman, University of Maryland/ CALCE; Babak Arfaei, Ford Motor Company; Andre Delhaise, Celestica, Inc,; Keith Howell, Nihon Superior Company, Ltd.; Jasbir Bath, Bath Consultancy; Stuart Longgood, Delphi; Andre Kleyner, Sagg Computers; Julie Silk, Keysight Technologies; Ranjit Pandher, Eric Lundeen, and Jerome Noiray, Alpha Assembly Solutions

>>Effect of TIM Compresion Load on BGA Reliability
*Lars Bruno, Ericsson AB; Nicholas Graziano, SUNY; Harry Schoeller, Universal Instruments Corporation 

Thursday October 18, 2018 10:00am - 12:00pm CDT
Room 49