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Thursday, October 18 • 8:00am - 9:30am
LF1: Low Temp Solder Paste and its Process Development

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Chair:  Jason Fullerton, Alpha Assembly Solutions
Co-Chair: Debbie Carboni, KYZEN Corporation

>>iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes Part IV: Comprehensive Mechanical Shock Tests on POP Components Having Mixed BGA BiSn-SAC Solder Joints
*Raiyo Aspandiar, Ph.D., Jagadeesh Radhakrishnan, Kevin Byrd, Shunfeng Cheng, Scott Mokler, Kok Kwan Tang, Intel Corporation; Haley Fu, iNEMI; *Babak Arfaei,  Binghamton University; Morgana Ribas, Alpha Assembly Solutions; Jimmy Chen, Flex; Qin Chen, Eunow; Richard Coyle, Nokia; Derek Daily, Senju Comtek Corp., Sophia Feng, Celestica Inc.; Mark Krmpotich, Microsoft Corporation; Brook Sandy-Smith,  Anny Zhang, Indium Corporation; Greg Wu, Wistron; Wilson Zhen, Lenovo

>>Low Temperature Soldering Reflow Optimization for Enhanced Mechanical Reliability
*Morgana Ribas, Ph.D., *Morgana Ribas, Ph.D., H. V. Ramakrishna, Laxminarayana Pai, Raghu Raj Rangaraju, Suresh Telu, Bhaskar Vangapandu, Ramesh Kumar, Traian Cucu, Siuli Sarkar, Alpha Assembly Solutions

>>The Impact of the Alloy Composition on Shear Strength of Low Temperature Lead Free Solder Joints
*Traian Cucu, Ph.D., Anna Lifton, Alpha Assembly Solutions

Thursday October 18, 2018 8:00am - 9:30am CDT
Room 49