Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc. Co-Chair: *Raiyo Aspandiar, Ph.D., Intel Corporation
>>How Wet is Wet – Robust Automotive Electronics in Humid Environment *Lothar Henneken, Daniel Markus, Daniel Koenig , Robert Bosch GmbH
>>ASEP (Application Specific Electronics Package) A Next Generation Electronics Manufacturing Technology Victor Zaderej, Richard Fitzpatrick, Molex
>> Fatigue and Shear Properties of High Reliable Solder Joints for Harsh Applications Su Sinan, Minghong Jian, Francy John Akkara, Mohammed Abueed, Sa’d Hamasha, Ph.D., Jeff Suhling, Ph.D., Pradeep Lal, Ph.D., Auburn University
Monday October 15, 2018 1:30pm - 3:00pm CDT
Room 48
