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Monday, October 15 • 1:30pm - 3:00pm
HE3: New Materials and Methods for Electronic Products in Harsh Environments

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Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc.
Co-Chair: *Raiyo Aspandiar, Ph.D., Intel Corporation

>>How Wet is Wet – Robust Automotive Electronics in Humid Environment
*Lothar Henneken, Daniel Markus, Daniel Koenig , Robert Bosch GmbH

>>ASEP (Application Specific Electronics Package) A Next Generation Electronics Manufacturing Technology
Victor Zaderej, Richard Fitzpatrick,  Molex

>> Fatigue and Shear Properties of High Reliable Solder Joints for Harsh Applications
Su Sinan, Minghong Jian, Francy John Akkara, Mohammed Abueed, Sa’d Hamasha, Ph.D., Jeff Suhling, Ph.D., Pradeep Lal, Ph.D.,  Auburn University

Monday October 15, 2018 1:30pm - 3:00pm CDT
Room 48