>>Effect of Component Density on Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Harsh Environment Won Sik Hong, Jinju Yu, Chulmin Oh , Korea Electronics Technology Institute(KETI)
>> Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes on the Component Reliability in Harsh Thermal Cycling Francy John Akkara, Mohammed Abueed, Sa’d Hamasha, Ph.D., Jeff Suhling, Ph.D., Pradeep Lal, Ph.D., Auburn University
Monday October 15, 2018 10:30am - 12:00pm CDT
Room 48