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Monday, October 15 • 10:30am - 12:00pm
HE2: Reliability of Lead-Free Solder Alloys in Automotive Environment

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Chair: *Babak Arfaei, Ph.D., Ford Motor Company
Co-Chair: Keith Howell, Nihon Superior Co.

>>Developing Pb-Free Solders for Harsh Environment Applications
*Mehran Maalekian, Ph.D., AIM Solder

>>Effect of Component Density on Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Harsh Environment
Won Sik Hong, Jinju Yu, Chulmin Oh , Korea Electronics Technology Institute(KETI)

>> Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes on the Component Reliability in Harsh Thermal Cycling
Francy John Akkara, Mohammed Abueed, Sa’d Hamasha, Ph.D., Jeff Suhling, Ph.D., Pradeep Lal, Ph.D., Auburn University 

Monday October 15, 2018 10:30am - 12:00pm CDT
Room 48