Loading…
SMTA International has ended
Back To Schedule
Wednesday, October 17 • 8:00am - 10:00am
SUB3: PCB Reliability

Sign up or log in to save this to your schedule, view media, leave feedback and see who's attending!

Chair: *Lars Boettcher, Fraunhofer IZM
Co-Chair: *Jörg Trodler, Heraeus Electronics

>>BGA Pad Cratering and Peeling During SMT Reflow
Joe Fuller, Amit Abraham, Aravind Munukutla, Ian Williams, Intel Corporation

>>PCB Reliability – and How to Audit Your Supply Base to Insure It!
Yashesh Sutariya, Saturn Electronics

>>Influence of Bonding Parameters on Reliability of Cu Wire-bonding to Electroless Ni/Pd/Au Plating
*Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu, Kiyoshi Hasegawa, Hitachi Chemical Co., Ltd.

>>Comprehensive Study of Various Short Failures on Printed Circuited Board
Xiao He, Baojun Qiu, Daojun Luo, CEPREI

Wednesday October 17, 2018 8:00am - 10:00am CDT
Room 46