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Tuesday, October 16 • 1:30pm - 3:30pm
SUB2: Enhanced Copper Plating Technologies

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Chair: *Lars Boettcher, Fraunhofer IZM
Co-Chair: *Jörg Trodler, Heraeus Electronics

>>High Elongation Electroless Copper
Rogers Bernards, Judy Ding, Boen Li, Richard Retallick,  MacDermid Enthone Electronic Solutions

>>The Benefits of Using Insoluble Anodes in Acid Copper Plating
*George Milad, Uyemura International Corporation

>>Innovative CU Electroplating Process for Any Layer via Fill With Planer via Top and Thin Surface Copper
Saminda Dharmarathna, Ph.D., Todd Clark, William Bowerman, Kesheng Feng, Jim Watkowski, MacDermid Enthone Electronic Solutions
Tuesday October 16, 2018 1:30pm - 3:30pm CDT
Room 48
  Conference Session, SUB Track