Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc. Co-Chair: *Iulia Muntele, Ph.D., Sanmina Corporation
>>Rework Practices for µLED’s and Other Highly Miniaturized SMT Components Neil O'Brien, Finetech
>>Laser Rework Process For BGA a New Method for PCBA Rework Instead of Hot Air/Infrared Heating Vikalp Narayan, John Burke, Naveen Kini, Ben choi, Robin Zhu, Herrick Fu , Alex Dai, Western Digital
>>Comparison Study Between Lead Free Solder and Low Temperature Solder for Hand Soldering Rework Steve Folsom, Maria Mejias-Hernandez, Connie Lavinger, Intel Corporation
Thursday October 18, 2018 10:00am - 11:30am CDT
Room 46
