>>Reflow Blower and Vibration Characterizaion, Effect on BGA Bridging Jason Stafford, Supriya Agrawal, Intel Corporation
>>Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data Fred Dimock, BTU International
>>Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – DoE Tests *Viktoria Rawinski, Joe Clure, ERSA; Denis Jean, Marcel Buck, Kester
Wednesday October 17, 2018 1:00pm - 3:00pm CDT
Room 46