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Wednesday, October 17 • 1:00pm - 3:00pm
MFX5: Reflow Technologies

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Chair: *Ray Whittier, BAE Systems
Co-Chair: *Chrys Shea, Shea Engineering Services

>>Reflow Blower and Vibration Characterizaion, Effect on BGA Bridging
Jason Stafford, Supriya Agrawal, Intel Corporation

>>Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Fred Dimock, BTU International

>>Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – DoE Tests
*Viktoria Rawinski, Joe Clure, ERSA; Denis Jean, Marcel Buck, Kester

Wednesday October 17, 2018 1:00pm - 3:00pm CDT
Room 46