Chair: Sal Sparacino, ZESTRON USA Co-Chair: Jason Fullerton, Alpha Assembly Solutions
>>Sharp Edge Coverage and Coating Thickness in Determining Performance of Liquid Applied Conformal Coatings in Harsh Environments Phil Kinner, Electrolube
>>SIR Characterization of No-Clean Flux Residues Under the QFN Component Using Different PCB Board Design Options *Mike Bixenman, DBA, David Lober, KYZEN Corporation; *Mark McMeen, Collin Langley, STI Electronics
>>Assessing the Implications of Fine Mesh Solder Powder on Flux Residue Removal Kalyan Nukala, M.S.Ch.E., Ravi Parthasarathy, M.S.Ch.E., ZESTRON Americas; Tim O’Neill, AIM; Terry Munson, Foresite
Wednesday October 17, 2018 10:30am - 12:00pm CDT
Room 46
