Loading…
SMTA International has ended
Back To Schedule
Wednesday, October 17 • 8:00am - 9:30am
MFX3: Void Reduction/BTC Challenges in Assembly

Sign up or log in to save this to your schedule, view media, leave feedback and see who's attending!

Chair: Neeta Argawal, Benchmark Electronics
Co-Chair: Timothy O'Neill, AIM Solder

>>Practical Verification of Void Reduction Method for BTC Using Exposed Via in Pad
*Iulia Muntele, Ph.D., Sanmina Corporation

>>Characterizing Voiding in BTC Center Pads
*Chrys Shea, Shea Engineering Services; Neil Poole, Ph.D., Henkel Electronic Materials

>>Solder Paste Selection Challenges for Bottom Termination Components (BTC) Attach
*Anna Lifton, Westin Bent, Paul Salerno, Jason Fullerton, Frank Andres, Alpha Assembly Solutions

Wednesday October 17, 2018 8:00am - 9:30am CDT
Room 46