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Wednesday, October 17 • 8:00am - 9:30am
MFX3: Void Reduction/BTC Challenges in Assembly

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Chair: Neeta Argawal, Benchmark Electronics
Co-Chair: Timothy O'Neill, AIM Solder

>>Practical Verification of Void Reduction Method for BTC Using Exposed Via in Pad
*Iulia Muntele, Ph.D., Sanmina Corporation

>>Characterizing Voiding in BTC Center Pads
*Chrys Shea, Shea Engineering Services; Neil Poole, Ph.D., Henkel Electronic Materials

>>Solder Paste Selection Challenges for Bottom Termination Components (BTC) Attach
*Anna Lifton, Westin Bent, Paul Salerno, Jason Fullerton, Frank Andres, Alpha Assembly Solutions

Wednesday October 17, 2018 8:00am - 9:30am CDT
Room 46