Sched.com Conference Mobile Apps
SMTA International
has ended
Create Your Own Event
Menu
Schedule
Register to Attend!
Map
Search
Log in
Sign up
SMTA International
-
Saved To
My Schedule
Schedule
Simple
Expanded
Grid
By Venue
Register to Attend!
Map
Search
Back To Schedule
Wednesday
, October 17 • 8:00am - 9:30am
MFX3: Void Reduction/BTC Challenges in Assembly
Sign up
or
log in
to save this to your schedule, view media, leave feedback and see who's attending!
Tweet
Share
Chair: Neeta Argawal, Benchmark Electronics
Co-Chair: Timothy O'Neill, AIM Solder
>>Practical Verification of Void Reduction Method for BTC Using Exposed Via in Pad
*Iulia Muntele, Ph.D., Sanmina Corporation
>>Characterizing Voiding in BTC Center Pads
*Chrys Shea, Shea Engineering Services; Neil Poole, Ph.D., Henkel Electronic Materials
>>Solder Paste Selection Challenges for Bottom Termination Components (BTC) Attach
*Anna Lifton, Westin Bent, Paul Salerno, Jason Fullerton, Frank Andres, Alpha Assembly Solutions
Wednesday October 17, 2018 8:00am - 9:30am CDT
Room 46
Conference Session
,
MFX Track