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Tuesday, October 16 • 1:30pm - 4:00pm
MFX2: Assembly Challenges

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Chair: *Iulia Muntele, Ph.D., Sanmina Corporation
Co-Chair: *Robert Boguski, Datest Corp.

>>Cavity Board SMT Assembly Challenges
Brett Grossman, *Dudi Amir, Intel Corporation

>>How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
*Jasbir Bath, Bath Consultancy; *Greg Smith, BlueRing Stencils; *Tony Lentz, FCT Assembly, Inc.

>>Qualitative Model Describing Hot Tear Above VIPPOs and Numerous Other Design Elements
Günter Gera, Yin Jizhe, Udo Welzel, Robert Bosch GmbH

>>Technology for Components with a High Position Accuracy
*Jörg Trodler, Heraeus Electronics

Tuesday October 16, 2018 1:30pm - 4:00pm CDT
Room 46