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Tuesday, October 16 • 11:00am - 12:30pm
MFX1: Solder Printing

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Chair: *Raymond Lawrence, General Microcircuits Inc.
Co-Chair:  Ivan Roman, Continental Corporation

>>Rational Application of Impractical Stencil Aperture Designs to Enable M0201 Heterogeneous Assembly
*Jeff Schake, Mark Whitmore, ASM Assembly Systems

>>Impact of Stencil Quality & Technology on Solder Paste Printing Performance
Jonas Sjoberg, Jeffrey Len Yung Kwuan, Leon Rao, Evan Yip, Wisdom Qu, Indium Corporation, Asia-Pacific

>>Evaluating the Next Generation of Stencil Stepping Technologies
Greg Smith, Blue Ring Stencils; Chrys Shea , Shea Engineering Services

Tuesday October 16, 2018 11:00am - 12:30pm CDT
Room 46