Chair: *Raymond Lawrence, General Microcircuits Inc. Co-Chair: Ivan Roman, Continental Corporation
>>Rational Application of Impractical Stencil Aperture Designs to Enable M0201 Heterogeneous Assembly *Jeff Schake, Mark Whitmore, ASM Assembly Systems
>>Impact of Stencil Quality & Technology on Solder Paste Printing Performance Jonas Sjoberg, Jeffrey Len Yung Kwuan, Leon Rao, Evan Yip, Wisdom Qu, Indium Corporation, Asia-Pacific
>>Evaluating the Next Generation of Stencil Stepping Technologies Greg Smith, Blue Ring Stencils; Chrys Shea , Shea Engineering Services
Tuesday October 16, 2018 11:00am - 12:30pm CDT
Room 46
