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Thursday, October 18 • 1:00pm - 2:30pm
INS3: Inspection Capabilities

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Chair: *Robert Boguski, Datest Corp.
Co-Chair: Todd McFadden, Bose

>>X-ray Inspection: New Capabilities and Methodology for PCBA Analysis
Julien Perraud, Arnaud Grivon, Shaďma Enouz-Vedrenne, Thales

>>Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA) Package Using Laser Ultrasonic Inspection Technique
Vishnu V.B. Reddy, Chidinma C. Imediegwu, Chong Ye, I. Charles Ume, Bryan Rogers, Cherif Guirguis, Kathy Derksen, Parimal Patel, Georgia Institute of Technology; Kola Akinade, Cisco Systems

>>The Hygroscopic Capacity of Integrated Circuit Packages and Printed Circuit Boards
Steven Watson, David Rathbone, Matthew Domanic, Kaitlyn Fox, VTO Labs

Thursday October 18, 2018 1:00pm - 2:30pm CDT
Room 48