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Thursday, October 18 • 10:00am - 12:00pm
INS2: Inspection 4.0

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Chair: *Keith Bryant, YXLON International GmbH
Co-Chair: *Diganta Das, Ph.D., CALCE/ University of Maryland

>>Advancement of Solder Paste Inspection (SPI) Tools to Support Industry 4.0 & Package Scaling
Larry Pymento, Abhishek Prasad, Ph.D., Srinivasa R Aravamudhan and Chandru Periasamy, Intel Corporation

>>Combining Automated Advanced Process Control (APC) with Mounter Feedback to Revolutionize the PCBA Process
David Suh, Brent Fischthal, Koh Young America, Inc.

>>Industry 4.0 for Inspection in the Electronics Industry
*Ragnar Vaga, YXLON International GmbH

>>Extending 3D MRS Technology to Address Challenging Inspection and Measurement Applications
John Hoffman, Ph.D., CyberOptics Corporation

Thursday October 18, 2018 10:00am - 12:00pm CDT
Room 48