Chair: *Keith Bryant, YXLON International GmbH Co-Chair: *Diganta Das, Ph.D., CALCE/ University of Maryland
>>Advancement of Solder Paste Inspection (SPI) Tools to Support Industry 4.0 & Package Scaling Larry Pymento, Abhishek Prasad, Ph.D., Srinivasa R Aravamudhan and Chandru Periasamy, Intel Corporation
>>Combining Automated Advanced Process Control (APC) with Mounter Feedback to Revolutionize the PCBA Process David Suh, Brent Fischthal, Koh Young America, Inc.
>>Industry 4.0 for Inspection in the Electronics Industry *Ragnar Vaga, YXLON International GmbH
>>Extending 3D MRS Technology to Address Challenging Inspection and Measurement Applications John Hoffman, Ph.D., CyberOptics Corporation
Thursday October 18, 2018 10:00am - 12:00pm CDT
Room 48
