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Thursday, October 18 • 8:00am - 9:30am
INS1: Inspection Applications

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Chair: *Bill Cardoso, Ph.D., Creative Electron
Co-Chair: *Keith Bryant, YXLON International GmbH

>>How X-ray Technology is Improving the Electronics Assembly Process
Griffin Lemaster, Creative Electron

>>Continuing Test Point Management Throughout a PCB Design Flow

Zac Elliott, Mark Laing, Mentor, a Siemens Business

>>Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes
Miloš Lazić, Brook Sandy-Smith, Indium Corporation; *Martin Anselm, Rochester Institute of Technology (RIT) 

Thursday October 18, 2018 8:00am - 9:30am CDT
Room 48