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Wednesday, October 17 • 10:30am - 12:00pm
FSA4: Low Melting Point Materials Development

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Chair: Andy Behr, US Panasonic
Co-Chair: Olga Spaldon-Stewart, Kester

>>Novel High Reliability Low Temperature Solder Alloys
*Ning-Cheng, Lee, Ph.D., Francis Mutuku, Jie Geng, Hongwen Zhang , Indium Corporation

>>A Study on the Minimum and Maximum Temperatures of the Reflow Process in SMT Assembly on Paste Ccontaining Bismuth Alloys Combined With Lead-Free Solder Spheres
*Martin Anselm, Ph.D., Priscilla Gomez, Tayler Swanson, Rochester Institute of Technology (RIT)

>>Engineered Flux for Low Temperature Solders
Ramakrishna Hosur Venkatagiriyappa, Ph.D., Harish H S, Manjuvani J, Vangapandu Bhaskar, Ramesh Kumar, Siuli Sarkar and Vikas Patil, Alpha Assembly Solutions

Wednesday October 17, 2018 10:30am - 12:00pm CDT
Room 49