Chair: Andy Behr, US Panasonic Co-Chair: Olga Spaldon-Stewart, Kester
>>Novel High Reliability Low Temperature Solder Alloys *Ning-Cheng, Lee, Ph.D., Francis Mutuku, Jie Geng, Hongwen Zhang , Indium Corporation
>>A Study on the Minimum and Maximum Temperatures of the Reflow Process in SMT Assembly on Paste Ccontaining Bismuth Alloys Combined With Lead-Free Solder Spheres *Martin Anselm, Ph.D., Priscilla Gomez, Tayler Swanson, Rochester Institute of Technology (RIT)
>>Engineered Flux for Low Temperature Solders Ramakrishna Hosur Venkatagiriyappa, Ph.D., Harish H S, Manjuvani J, Vangapandu Bhaskar, Ramesh Kumar, Siuli Sarkar and Vikas Patil, Alpha Assembly Solutions
Wednesday October 17, 2018 10:30am - 12:00pm CDT
Room 49
