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Wednesday, October 17 • 8:00am - 10:00am
FSA3: Considerations for Assuring Reliable Assemblies

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Chair: *Phil Kinner, Electrolube
Co-Chair: Nilesh Badwe, Intel Corporation

>>Dissolution Rate of Specific Elements in SAC305 Solder
*David Hillman, Ross Wilicoxon, Tim Pearson, Paul McKenna, Rockwell Collins

>>Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
*Mike Bixenman, DBA, KYZEN Corporation; *Mark McMeen, STI Electronics; *Denis Jean, Kester Solder; Joe Clure, Kurtz Ersa

>>Development of an Enhanced Low Melting Point Alloy
Steven Teliszewski, Interflux Electronics N.V. ; Albrecht Beck, ERSA North America

Wednesday October 17, 2018 8:00am - 10:00am CDT
Room 49