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Tuesday, October 16 • 11:00am - 12:30pm
FSA1: Solder Paste Development to Overcome Component Challenges

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Chair: Ursula Marquezdetino, Plexus Corp.
Co-Chair: Adam Murling, Indium Corporation

>>Robust SMT No-Clean Solder Paste for SiP and 01005 Assembly
*Ning-Cheng Lee, Ph.D., Xiaoqin Lu, Fen Chen, Indium Corporation

>>The Influence of Aspects of Solder Paste Formulation and Soldering Process Factors on Voiding Under Large QFN Devices
Mathew Jones, Henkel; Tamara Goas-Fernandez; Barry Wenham

>>Rheology and Wetting Characterizations of Flux and Solder Paste for BGA Packages
Jinlin Wang, Intel Corporation

Tuesday October 16, 2018 11:00am - 12:30pm CDT
Room 49