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Thursday, October 18 • 10:00am - 12:00pm
APT7: Reliaiblity of Low Temperature Solder (LTS) Interconnects

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Chair: *Charles Woychik, i3Electronics
Co-Chair: *Steve Greathouse, Plexus Corp.

>>Low Temperature Solder Interconnect Reliability and Potential Application in Enterprise Computer and Automotive Electronics

*Paul Wang, Ph.D., David He, Vivi Cao, Jopy Tan, Mitac International Corporation

>>Low Melting Temperature Interconnect Thermal Cycling Performance Enhancement Using Elemental Tuning and Edgebond Application
*Tae Kyu Lee, Ph.D., Andy Hsiao, Mohamed Sheikh, Imbok Lee, Young-Woo Lee, Edward Ibe, Karl Loh, Tae-Kyu Lee, Portland State University

>>A Novel Approach To Determine Mechanical Fatigue Performance of Solder Material Using Single Solder Joint Test
Satyajit Walwadkar, Ph.D., *Raiyo Aspandiar, Ph.D., George Hsieh, Kevin Byrd, Intel Corporation

>>Thermomechanical Reliability of Low-Temperature Solder Alloys for Mid-Power LED Packages
*Ranjit Pandher, Ph.D., Niveditha Nagarajan; Nicholas Herrick, Alpha Assembly Solutions

Thursday October 18, 2018 10:00am - 12:00pm CDT
Room 44