>>Comparison of Reliability of Copper, Gold, Silver, and PCC Wirebonds Under Sustained Operation at 200C *Pradeep Lall, Ph.D., Shantanu Deshpande, Luu Nguyen, Auburn University
>>Copper-Tin Intermetallics: Their Importance, Growth Rate, and Nature *Ron Lasky, Ph.D., Indium Corporation
>>The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates Kazuhiro Nogita, The University of Queensland; Keith Sweatman; Tetsuro Nishimura, Nihon Superior Co. Ltd.
Thursday October 18, 2018 8:00am - 9:30am CDT
Room 44
